Inventor · disambiguated record
Michael D. Armacost
Also filed as: ARMACOST MICHAEL · ARMACOST MICHAEL D · ARMACOST MICHAEL DAVID
41 granted patents·18 pending applications·1,057 citations·filing 1991–2024
98Inventor score
Top patents by PatentIndex Score
59 records- 0196US6780753B2Airgap for semiconductor devicesAPPLIED MATERIALS INC·Filed 2002·Granted Aug 24, 2004·126 cites·18 claims
- 0294US6829056B1Monitoring dimensions of features at different locations in the processing of substratesFiled 2003·Granted Dec 7, 2004·107 cites·19 claims
- 0393US6518112B2High performance, low power vertical integrated CMOS devicesIBM·Filed 2001·Granted Feb 11, 2003·67 cites·22 claims
- 0490US7226853B2Method of forming a dual damascene structure utilizing a three layer hard mask structureAPPLIED MATERIALS INC·Filed 2002·Granted Jun 5, 2007·51 cites·27 claims
- 0589US6297531B2High performance, low power vertical integrated CMOS devicesIBM·Filed 1998·Granted Oct 2, 2001·73 cites·33 claims
- 0689US5521422ACorner protected shallow trench isolation deviceIBM·Filed 1994·Granted May 28, 1996·89 cites·10 claims
- 0787US10770321B2Process kit erosion and service life predictionAPPLIED MATERIALS INC·Filed 2019·Granted Sep 8, 2020·4 cites·17 claims
- 0886US10177018B2Process kit erosion and service life predictionAPPLIED MATERIALS INC·Filed 2017·Granted Jan 8, 2019·4 cites·17 claims
- 0986US7115534B2Dielectric materials to prevent photoresist poisoningAPPLIED MATERIALS INC·Filed 2004·Granted Oct 3, 2006·39 cites·21 claims
- 1083US5545581APlug strap process utilizing selective nitride and oxide etchesIBM·Filed 1994·Granted Aug 13, 1996·71 cites·31 claims
- 1180US5811357AProcess of etching an oxide layerIBM·Filed 1997·Granted Sep 22, 1998·57 cites·13 claims
- 1275US6734096B2Fine-pitch device lithography using a sacrificial hardmaskIBM·Filed 2002·Granted May 11, 2004·22 cites·17 claims
- 1375US5466626AMicro mask comprising agglomerated materialIBM·Filed 1993·Granted Nov 14, 1995·50 cites·16 claims
- 1474US12314340B2Anomaly detection from aggregate statistics using neural networksAPPLIED MATERIALS INC·Filed 2023·Granted May 27, 2025·0 cites·18 claims
- 1572US8143138B2Method for fabricating interconnect structures for semiconductor devicesPATZ RYAN JAMES·Filed 2008·Granted Mar 27, 2012·6 cites·6 claims
- 1670US6342722B1Integrated circuit having air gaps between dielectric and conducting linesIBM·Filed 1999·Granted Jan 29, 2002·37 cites·7 claims
- 1770US6051504AAnisotropic and selective nitride etch process for high aspect ratio features in high density plasmaIBM·Filed 1997·Granted Apr 18, 2000·39 cites·15 claims
- 1867US7572734B2Etch depth control for dual damascene fabrication processAPPLIED MATERIALS INC·Filed 2007·Granted Aug 11, 2009·2 cites·20 claims
- 1967US6750113B2Metal-insulator-metal capacitor in copperIBM·Filed 2001·Granted Jun 15, 2004·12 cites·5 claims
- 2066US12511407B2Methods and mechanisms for secure data sharingAPPLIED MATERIALS INC·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 2164US11657122B2Anomaly detection from aggregate statistics using neural networksAPPLIED MATERIALS INC·Filed 2020·Granted May 23, 2023·0 cites·20 claims
- 2263US5759867AMethod of making a disposable corner etch stop-spacer for borderless contactsIBM·Filed 1995·Granted Jun 2, 1998·23 cites·8 claims
- 2363US2025165591A1Methods and mechanisms to perform automated classifications of anomalous trace shapesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2461US6207353B1Resist formulation which minimizes blistering during etchingIBM·Filed 1997·Granted Mar 27, 2001·28 cites·20 claims
- 2561US2024427324A1Integrated hybrid predictive monitoring of manufacturing systemsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2661US2025172931A1Excursion screening models for improving accuracy of excursion detection within manufacturing systemsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2760US2025271846A1Autonomous fault diagnostic tools for manufacturing systems by analyzing process runsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2859US5622596AHigh density selective SiO2 :Si3 N4 etching using a stoichiometrically altered nitride etch stopIBM·Filed 1995·Granted Apr 22, 1997·23 cites·5 claims
- 2958US5618379ASelective deposition processIBM·Filed 1991·Granted Apr 8, 1997·24 cites·17 claims
- 3057US6489005B1Method of making silicon article having columnsIBM·Filed 2000·Granted Dec 3, 2002·6 cites·5 claims
- 3156US6187412B1Silicon article having columns and method of makingIBM·Filed 1997·Granted Feb 13, 2001·17 cites·19 claims
- 3255US2025035680A1Methods and mechanisms to improve monitoring capabilities using rate of change of sensor valuesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3353US5766968AMicro mask comprising agglomerated materialIBM·Filed 1995·Granted Jun 16, 1998·17 cites·17 claims
- 3451US2024184858A1Methods and mechanisms for automatic sensor grouping to improve anomaly detectionAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3549US6090722AProcess for fabricating a semiconductor structure having a self-aligned spacerIBM·Filed 1999·Granted Jul 18, 2000·14 cites·19 claims
- 3649US5767017ASelective removal of vertical portions of a filmIBM·Filed 1995·Granted Jun 16, 1998·15 cites·34 claims
- 3749US2006246683A1Integrated equipment set for forming a low K dielectric interconnect on a substrateAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3847US2009286402A1Method for critical dimension shrink using conformal pecvd filmsAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 3946US2009317628A1Methods and appartus to prevent contamination of a photoresist layer on a substrateAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 4045US10901407B2Semiconductor device search and classificationAPPLIED MATERIALS INC·Filed 2017·Granted Jan 26, 2021·0 cites·20 claims
- 4144US10541169B2Method and system for balancing the electrostatic chucking force on a substrateAPPLIED MATERIALS INC·Filed 2017·Granted Jan 21, 2020·0 cites·17 claims
- 4241US7758763B2Plasma for resist removal and facet control of underlying featuresAPPLIED MATERIALS INC·Filed 2006·Granted Jul 20, 2010·0 cites·13 claims
- 4341US6228279B1High-density plasma, organic anti-reflective coating etch system compatible with sensitive photoresist materialsIBM·Filed 1998·Granted May 8, 2001·9 cites·10 claims
- 4441US2004007325A1Integrated equipment set for forming a low K dielectric interconnect on a substrateAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 4539US10303812B2Topography prediction using system state informationAPPLIED MATERIALS INC·Filed 2016·Granted May 28, 2019·0 cites·20 claims
- 4639US2009140418A1Method for integrating porous low-k dielectric layersLI SIYI·Filed 2007·Application pending·0 cites
- 4739US2004206621A1Integrated equipment set for forming a low K dielectric interconnect on a substrateFiled 2004·Application pending·0 cites
- 4839US2013309785A1Rotational absorption spectra for semiconductor manufacturing process monitoring and controlAPPLIED MATERIAL INC·Filed 2013·Application pending·0 cites
- 4938US6232222B1Method of eliminating a critical mask using a blockout mask and a resulting semiconductor structureIBM·Filed 1999·Granted May 15, 2001·6 cites·16 claims
- 5038US5714798ASelective deposition processIBM·Filed 1996·Granted Feb 3, 1998·6 cites·11 claims
Showing the top 50 of 59 patent records by PatentIndex Score.
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