Inventor · disambiguated record
Cheng-Hsu Hsiao
Also filed as: HSIAO CHENG H · HSIAO CHENG-HSU
58 granted patents·46 pending applications·1,233 citations·filing 2001–2015
99Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD93CHANG CHIN-HUANG2HUANG CHIEN-PING2HUANG WEN-HOME1PU HAN-PING1
Top patents by PatentIndex Score
104 records- 0197US6444498B1Method of making semiconductor package with heat spreaderSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Sep 3, 2002·146 cites·19 claims
- 0296US7772685B2Stacked semiconductor structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Aug 10, 2010·44 cites·8 claims
- 0396US7364944B2Method for fabricating thermally enhanced semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Apr 29, 2008·46 cites·10 claims
- 0494US7271483B2Bump structure of semiconductor package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Sep 18, 2007·76 cites·18 claims
- 0594US7170152B2Wafer level semiconductor package with build-up layer and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Jan 30, 2007·73 cites·11 claims
- 0693US7732913B2Semiconductor package substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Jun 8, 2010·71 cites·12 claims
- 0793US7638879B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Dec 29, 2009·26 cites·9 claims
- 0891US6458626B1Fabricating method for semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Oct 1, 2002·64 cites·22 claims
- 0990US7855443B2Stack structure of semiconductor packages and method for fabricating the stack structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Dec 21, 2010·19 cites·4 claims
- 1090USD529031SIC card type circuit moduleSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Sep 26, 2006·41 cites·1 claims
- 1189US7019406B2Thermally enhanced semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Mar 28, 2006·45 cites·10 claims
- 1288US7671466B2Semiconductor package having heat dissipating device with cooling fluidSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Mar 2, 2010·14 cites·9 claims
- 1388US7615862B2Heat dissipating package structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Nov 10, 2009·14 cites·7 claims
- 1488US7564140B2Semiconductor package and substrate structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Jul 21, 2009·17 cites·12 claims
- 1588US7132312B2Method for fabricating semiconductor package having conductive bumps on chipSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Nov 7, 2006·15 cites·12 claims
- 1688US6919630B2Semiconductor package with heat spreaderSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Jul 19, 2005·47 cites·12 claims
- 1788US6849942B2Semiconductor package with heat sink attached to substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Feb 1, 2005·48 cites·11 claims
- 1887US8058100B2Method for fabricating chip scale package structure with metal pads exposed from an encapsulantPU HAN-PING·Filed 2010·Granted Nov 15, 2011·8 cites·14 claims
- 1987US7489044B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Feb 10, 2009·12 cites·11 claims
- 2087US7445957B2Method for fabricating wafer level semiconductor package with build-up layerSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Nov 4, 2008·13 cites·14 claims
- 2187US7196414B2Semiconductor package with heat sinkSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Mar 27, 2007·12 cites·6 claims
- 2287US7002245B2Semiconductor package having conductive bumps on chip and method for fabricating the sameSILICONWARE PRECICION IND CO L·Filed 2003·Granted Feb 21, 2006·47 cites·8 claims
- 2386US7759170B2Fabrication method of semiconductor package having heat dissipation deviceSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2010·Granted Jul 20, 2010·7 cites·14 claims
- 2486US7750467B2Chip scale package structure with metal pads exposed from an encapsulantSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Jul 6, 2010·12 cites·7 claims
- 2586US7745262B2Heat dissipating package structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2009·Granted Jun 29, 2010·11 cites·19 claims
- 2684US7485496B2Semiconductor device package with a heat sink and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Feb 3, 2009·15 cites·18 claims
- 2783US8183092B2Method of fabricating stacked semiconductor structureHUANG CHIEN-PING·Filed 2010·Granted May 22, 2012·6 cites·14 claims
- 2883US7679178B2Semiconductor package on which a semiconductor device can be stacked and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Mar 16, 2010·11 cites·26 claims
- 2983US6650006B2Semiconductor package with stacked chipsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Nov 18, 2003·35 cites·20 claims
- 3082US8062933B2Method for fabricating heat dissipating package structureHUANG CHIEN-PING·Filed 2007·Granted Nov 22, 2011·9 cites·13 claims
- 3182USD498760SDigital memory cardSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Nov 23, 2004·28 cites·1 claims
- 3281US7608915B2Heat dissipation semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Granted Oct 27, 2009·12 cites·11 claims
- 3380US6844622B2Semiconductor package with heat sinkSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Jan 18, 2005·26 cites·12 claims
- 3479USD492314SIC card type circuit moduleSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Jun 29, 2004·24 cites·1 claims
- 3578US7177155B2Semiconductor package with heat sinkSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Feb 13, 2007·6 cites·5 claims
- 3676US7005720B2Semiconductor package with photosensitive chip and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Feb 28, 2006·22 cites·20 claims
- 3776US6856015B1Semiconductor package with heat sinkSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Feb 15, 2005·22 cites·20 claims
- 3872US7993967B2Semiconductor package fabrication methodSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2009·Granted Aug 9, 2011·4 cites·16 claims
- 3972US7074645B2Fabrication method of semiconductor package with heat sinkSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Jul 11, 2006·15 cites·8 claims
- 4070US7348211B2Method for fabricating semiconductor packagesSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Mar 25, 2008·4 cites·26 claims
- 4169US8895366B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 25, 2014·2 cites·10 claims
- 4269US8013436B2Heat dissipation package structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Granted Sep 6, 2011·5 cites·7 claims
- 4368US8008769B2Heat-dissipating semiconductor package structure and method for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Granted Aug 30, 2011·3 cites·10 claims
- 4465US7666716B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2009·Granted Feb 23, 2010·2 cites·13 claims
- 4565US6989296B2Fabrication method of semiconductor package with photosensitive chipSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Jan 24, 2006·12 cites·22 claims
- 4664US8698326B2Semiconductor package and fabrication method thereofHUANG WEN-HOME·Filed 2007·Granted Apr 15, 2014·4 cites·10 claims
- 4761US7768106B2Multi-chip stack structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Granted Aug 3, 2010·2 cites·7 claims
- 4861USRE39957EMethod of making semiconductor package with heat spreaderSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Dec 25, 2007·8 cites·29 claims
- 4960US8361843B2Method for fabricating heat dissipation package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2011·Granted Jan 29, 2013·1 cites·9 claims
- 5060US6963135B2Semiconductor package for memory chipsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Nov 8, 2005·11 cites·7 claims
Showing the top 50 of 104 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →