Assignee
PU HAN-PING
TW·4 granted patents·597 citations·filing 2007–2011
Top patents by PatentIndex Score
4 records- 0198US8759964B2Wafer level package structure and fabrication methodsPU HAN-PING·Filed 2007·Granted Jun 24, 2014·584 cites·18 claims
- 0287US8058100B2Method for fabricating chip scale package structure with metal pads exposed from an encapsulantPU HAN-PING·Filed 2010·Granted Nov 15, 2011·8 cites·14 claims
- 0375US8420452B2Fabrication method of leadframe-based semiconductor packagePU HAN-PING·Filed 2011·Granted Apr 16, 2013·3 cites·9 claims
- 0467US8400178B2Method and system of testing a semiconductor devicePU HAN-PING·Filed 2009·Granted Mar 19, 2013·2 cites·20 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →