Inventor · disambiguated record
Sadasivan Shankar
Also filed as: SHANKAR SADASIVAN
13 granted patents·14 pending applications·63 citations·filing 2002–2020
89Inventor score
Top patents by PatentIndex Score
27 records- 0188US7021999B2Rinse apparatus and method for wafer polisherINTEL CORP·Filed 2005·Granted Apr 4, 2006·16 cites·4 claims
- 0283US10483385B2Nanowire structures having wrap-around contactsCEA STEPHEN M·Filed 2011·Granted Nov 19, 2019·4 cites·24 claims
- 0379US8779589B2Liner layers for metal interconnectsSIMKA HARSONO S·Filed 2010·Granted Jul 15, 2014·8 cites·21 claims
- 0475US10840366B2Nanowire structures having wrap-around contactsINTEL CORP·Filed 2019·Granted Nov 17, 2020·1 cites·20 claims
- 0575US6883153B2Minimization of microelectronic interconnect thickness variationsINTEL CORP·Filed 2003·Granted Apr 19, 2005·22 cites·18 claims
- 0667US11757026B2Nanowire structures having wrap-around contactsGOOGLE LLC·Filed 2020·Granted Sep 12, 2023·0 cites·20 claims
- 0764US7279084B2Apparatus having plating solution container with current applying anodesINTEL CORP·Filed 2004·Granted Oct 9, 2007·7 cites·6 claims
- 0854US9577057B2Semiconductor device contactsINTEL CORP·Filed 2015·Granted Feb 21, 2017·0 cites·16 claims
- 0952US2017162661A1Semiconductor device contactsINTEL CORP·Filed 2017·Application pending·0 cites
- 1051US6908370B1Rinse apparatus and method for wafer polisherINTEL CORP·Filed 2003·Granted Jun 21, 2005·4 cites·30 claims
- 1148US8154121B2Polymer interlayer dielectric and passivation materials for a microelectronic deviceSHAH KUNAL·Filed 2008·Granted Apr 10, 2012·0 cites·20 claims
- 1247US9166004B2Semiconductor device contactsHAVERTY MICHAEL G·Filed 2010·Granted Oct 20, 2015·0 cites·15 claims
- 1346US2005054143A1Using benzocyclobutene based polymers as underfill materialsFiled 2004·Application pending·0 cites
- 1444US6887131B2Polishing pad designINTEL CORP·Filed 2002·Granted May 3, 2005·1 cites·7 claims
- 1544US2009166867A1Metal interconnect structures for semiconductor devicesSIMKA HARSONO·Filed 2007·Application pending·0 cites
- 1643US2004159923A1Using benzocyclobutene based polymers as underfill materialsFiled 2003·Application pending·0 cites
- 1742US2009001591A1Reducing resistivity in metal interconnects by compressive strainingHAVERTY MICHAEL·Filed 2007·Application pending·0 cites
- 1842US2009004463A1Reducing resistivity in metal interconnects using interface controlHAVERTY MICHAEL·Filed 2007·Application pending·0 cites
- 1941US2007224834A1Dielectric material having carborane derivativesHAVERTY MICHAEL G·Filed 2006·Application pending·0 cites
- 2040US2015187900A1Composite materials for use in semiconductor componentsSHANKAR SADASIVAN·Filed 2013·Application pending·0 cites
- 2139US2006068190A1Electronic devices with molecular sieve layersINTEL CORP·Filed 2004·Application pending·0 cites
- 2239US2005287787A1Porous ceramic materials as low-k films in semiconductor devicesKLOSTER GRANT M·Filed 2004·Application pending·0 cites
- 2336US2007123059A1Methods of internal stress reduction in dielectric films with chemical incorporation and structures formed therebyHAVERTY MICHAEL G·Filed 2005·Application pending·0 cites
- 2435US2007269646A1Bond termination of pores in a porous diamond dielectric materialHAVERTY MICHAEL G·Filed 2006·Application pending·0 cites
- 2535US2006071300A1Dielectric material having carborane derivativesHAVERTY MICHAEL G·Filed 2004·Application pending·0 cites
- 2635US2006138087A1Copper containing abrasive particles to modify reactivity and performance of copper CMP slurriesSIMKA HARSONO S·Filed 2004·Application pending·0 cites
- 2734US8633534B2Transistor channel mobility using alternate gate dielectric materialsHAVERTY MICHAEL G·Filed 2010·Granted Jan 21, 2014·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →