Inventor · disambiguated record
Joong-Hyun Baek
Also filed as: BAEK JOONG-HYUN
28 granted patents·12 pending applications·423 citations·filing 1997–2012
97Inventor score
Top patents by PatentIndex Score
40 records- 0196US8791580B2Integrated circuit packages having redistribution structuresPARK CHUL·Filed 2012·Granted Jul 29, 2014·40 cites·18 claims
- 0292US9023639B2Apparatus for amplifying nucleic acidsKIM JAE-YOUNG·Filed 2008·Granted May 5, 2015·32 cites·18 claims
- 0392US8184439B2Semiconductor moduleBAEK JOONG-HYUN·Filed 2010·Granted May 22, 2012·21 cites·16 claims
- 0490US7301233B2Semiconductor chip package with thermoelectric coolerSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Nov 27, 2007·22 cites·20 claims
- 0589US6835598B2Stacked semiconductor module and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Dec 28, 2004·61 cites·28 claims
- 0688US8524539B2Method of manufacturing semiconductor packageLEE HEE-JIN·Filed 2011·Granted Sep 3, 2013·10 cites·18 claims
- 0784US8310046B2Wafer stacked package waving bertical heat emission path and method of fabricating the sameBAEK JOONG-HYUN·Filed 2011·Granted Nov 13, 2012·6 cites·2 claims
- 0884US7345882B2Semiconductor module with heat sink and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Mar 18, 2008·35 cites·23 claims
- 0983US7880291B2Integrated circuit package and integrated circuit moduleSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Feb 1, 2011·9 cites·20 claims
- 1081US8796835B2Package on package having improved thermal characteristicsKIM YONG-HOON·Filed 2011·Granted Aug 5, 2014·6 cites·20 claims
- 1179US6498395B2Heat sink with cooling fins for semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Dec 24, 2002·26 cites·8 claims
- 1278US7626261B2Wafer stacked package having vertical heat emission path and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 1, 2009·6 cites·13 claims
- 1378US7050303B2Semiconductor module with vertically mounted semiconductor chip packagesSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 23, 2006·24 cites·33 claims
- 1477US8049329B2Wafer stacked package waving bertical heat emission path and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Nov 1, 2011·5 cites·26 claims
- 1574US7800138B2Semiconductor device including thermally dissipating dummy padsSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Sep 21, 2010·13 cites·3 claims
- 1674US7473993B2Semiconductor stack package and memory module with improved heat dissipationSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 6, 2009·7 cites·16 claims
- 1774US6756668B2Semiconductor package having thermal interface material (TIM)SAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jun 29, 2004·19 cites·15 claims
- 1871US8344601B2Light emitting deviceSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Jan 1, 2013·3 cites·23 claims
- 1971US6781849B2Multi-chip package having improved heat spread characteristics and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 24, 2004·18 cites·24 claims
- 2068US8456000B2Semiconductor module and an electronic system including the sameBAEK JOONG-HYUN·Filed 2009·Granted Jun 4, 2013·3 cites·11 claims
- 2168US7705449B2Cooling apparatus for memory moduleSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 27, 2010·4 cites·42 claims
- 2264US6895666B2Underfill system for semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted May 24, 2005·12 cites·11 claims
- 2364US6498388B2Semiconductor module with improved solder joint reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Dec 24, 2002·12 cites·13 claims
- 2462US7812445B2Semiconductor memory module having an oblique memory chipSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 12, 2010·2 cites·23 claims
- 2562US7485006B2Memory module, socket and mounting method providing improved heat dissipating characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 3, 2009·2 cites·18 claims
- 2653US2006090884A1Heat pipe and heat pipe structurePARK SANG-WOOK·Filed 2005·Application pending·0 cites
- 2752US7081375B2Semiconductor package having thermal interface material (TIM)SAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jul 25, 2006·4 cites·8 claims
- 2850US2009130908A1Memory module, socket and mounting method providing improved heat dissipating characteristicsPARK SANG-WOOK·Filed 2008·Application pending·0 cites
- 2948US2010079966A1Memory moduleSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 3047US2006284309A1Integrated circuit package and integrated circuit moduleSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 3147US2009129026A1Heat sink for semiconductor device and semiconductor module assembly including the heat sinkSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3244US2008141933A1Semiconductor plating system for plating semiconductor objectSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3343US6326686B1Vertical semiconductor device package having printed circuit board and heat spreader, and module having the packagesSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Dec 4, 2001·12 cites·28 claims
- 3443US2007069396A1Semiconductor package, method of manufacturing the same, stacked semiconductor package including the same and method of manufacturing the stacked semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 3543US2007252257A1Semiconductor package structures having heat dissipative element directly connected to internal circuit and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3643US2008144292A1Semiconductor module with heat sink and method thereofLEE HAE-HYUNG·Filed 2008·Application pending·0 cites
- 3740US5897883AMold having projections for inhibiting the formation of air pocketsSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Apr 27, 1999·9 cites·7 claims
- 3840US2005133897A1Stack package with improved heat radiation and module having the stack package mounted thereonFiled 2004·Application pending·0 cites
- 3938US2004250989A1Clothespin type heat dissipating apparatus for semiconductor moduleFiled 2004·Application pending·0 cites
- 4034US2006006517A1Multi-chip package having heat dissipating pathLEE JIN-YANG·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →