Inventor · disambiguated record
Katsumi Okawa
Also filed as: OKAWA KATSUMI
22 granted patents·3 pending applications·623 citations·filing 1993–2016
96Inventor score
Top patents by PatentIndex Score
25 records- 0197US6548328B1Circuit device and manufacturing method of circuit deviceSANYO ELECTRIC CO·Filed 2000·Granted Apr 15, 2003·128 cites·25 claims
- 0295US6562660B1Method of manufacturing the circuit device and circuit deviceSANYO ELECTRIC CO·Filed 2000·Granted May 13, 2003·121 cites·29 claims
- 0390US6545364B2Circuit device and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2001·Granted Apr 8, 2003·63 cites·10 claims
- 0489US6975022B2Board for manufacturing a BGA and method of manufacturing semiconductor device using thereofSANYO ELECTRIC CO·Filed 2001·Granted Dec 13, 2005·50 cites·21 claims
- 0586US6528879B2Semiconductor device and semiconductor moduleSANYO ELECTRIC CO·Filed 2001·Granted Mar 4, 2003·43 cites·24 claims
- 0682US7276793B2Semiconductor device and semiconductor moduleSANYO ELECTRIC CO·Filed 2005·Granted Oct 2, 2007·9 cites·23 claims
- 0781US7609498B2Inverted circuit overcurrent protection device and hybrid integrated circuit device with the same incorporatedSANYO ELECTRIC CO·Filed 2006·Granted Oct 27, 2009·10 cites·8 claims
- 0878US7125798B2Circuit device and manufacturing method of circuit deviceSANYO ELECTRIC CO·Filed 2003·Granted Oct 24, 2006·20 cites·10 claims
- 0977US9892997B2Adaptable molded leadframe package and related methodINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2016·Granted Feb 13, 2018·3 cites·20 claims
- 1076US6756610B2Light irradiating deviceSANYO ELECTRIC CO·Filed 2003·Granted Jun 29, 2004·18 cites·13 claims
- 1176US6534330B2Light irradiating device manufacturing methodSANYO ELECTRIC CO·Filed 2001·Granted Mar 18, 2003·23 cites·22 claims
- 1275US7220921B1Sheet-like board member and method of manufacturing a semiconductor deviceSANYO ELECTRIC CO·Filed 2000·Granted May 22, 2007·22 cites·6 claims
- 1374US7173336B2Hybrid integrated circuit deviceSANYO ELECTRIC CO·Filed 2003·Granted Feb 6, 2007·17 cites·5 claims
- 1472US7091606B2Circuit device and manufacturing method of circuit device and semiconductor moduleSANYO ELECTRIC CO·Filed 2003·Granted Aug 15, 2006·19 cites·25 claims
- 1564US6558970B2Light irradiating device, manufacturing method thereof, and lighting apparatus using the light irradiating deviceSANYO ELECTRIC CO·Filed 2001·Granted May 6, 2003·10 cites·20 claims
- 1663US7138296B2Board for manufacturing a BGA and method of manufacturing semiconductor device using thereofSANYO ELECTRIC CO·Filed 2004·Granted Nov 21, 2006·9 cites·6 claims
- 1763US7136269B2Inverted circuit overcurrent protection device and hybrid integrated circuit device with the same incorporatedSANYO ELECTRIC CO·Filed 2003·Granted Nov 14, 2006·9 cites·7 claims
- 1860US6593169B2Method of making hybrid integrated circuit deviceSANYO ELECTRIC CO·Filed 2002·Granted Jul 15, 2003·9 cites·9 claims
- 1954US6975024B2Hybrid integrated circuit device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2002·Granted Dec 13, 2005·6 cites·22 claims
- 2053US7075762B2Inverter circuit device with temperature detection circuitSANYO ELECTRIC CO·Filed 2003·Granted Jul 11, 2006·11 cites·3 claims
- 2152US5469131AHybrid integrated circuit deviceSANYO ELECTRIC CO·Filed 1993·Granted Nov 21, 1995·20 cites·18 claims
- 2249US6974727B2Method of manufacturing a hybrid integrated circuit deviceSANYO ELECTRIC CO·Filed 2002·Granted Dec 13, 2005·3 cites·12 claims
- 2346US2006033209A1Hybrid integrated circuit deviceSANYO ELECTRIC CO·Filed 2005·Application pending·0 cites
- 2443US2005056916A1Circuit device and manufacturing method of circuit deviceSANYO ELECTRIC CO LTD A JAPAN·Filed 2004·Application pending·0 cites
- 2536US2001026014A1Semiconductor deviceFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →