Hybrid integrated circuit device

Abstract

In a molding process, a hybrid integrated circuit substrate is fixed the position of the substrate in a thickness direction. A leadframe is connected, with an upward inclination, to a hybrid integrated circuit substrate and transported into a mold cavity. By horizontally fixing the leadframe by mold dies, the hybrid integrated circuit substrate inclined upward is urged downward by a pushpin. This can fix the position of the hybrid integrated circuit substrate within the mold cavity and integrally transfer-molded.

1 . A hybrid integrated circuit device comprising: 
 a hybrid integrated circuit substrate;    a lead fixed on the hybrid integrated circuit substrate; and    a resin seal body transfer-molding the substrate and the lead;    wherein the substrate includes a region on which a pushpin for fixing the substrate is to urge during transfer molding.    
   
   
       2 . The hybrid integrated circuit device according to  claim 1 , the region where the pushpin is to urge is arranged in a peripheral region of the substrate.  
   
   
       3 . The hybrid integrated circuit device according to  claim 2 , wherein the substrate and a thermosetting resin are exposed in a bottom of a hole formed by the pushpin.  
   
   
       4 . The hybrid integrated circuit device according to  claim 3 , wherein the hole is formed at least two points in the resin seal body in a region above both ends of the substrate.  
   
   
       5 . The hybrid integrated circuit device according to  claim 3 , wherein the thermosetting resin is an epoxy resin.  
   
   
       6 - 17 . (canceled)