Inventor · disambiguated record
Roger Bernards
Also filed as: BERNARDS ROGER · BERNARDS ROGER F · BERNARDS ROGER FRANCIS
20 granted patents·13 pending applications·499 citations·filing 1988–2024
96Inventor score
Files withELECTROCHEMICALS INC8SHIPLEY CO8MACDERMID ENTHONE INC5OMG ELECTRONIC CHEMICALS INC4BERNARDS ROGER F3
Top patents by PatentIndex Score
33 records- 0196US5252196ACopper electroplating solutions and processesSHIPLEY CO·Filed 1991·Granted Oct 12, 1993·134 cites·46 claims
- 0290US7108795B2Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substratesELECTROCHEMICALS INC·Filed 2005·Granted Sep 19, 2006·17 cites·11 claims
- 0389US5223118AMethod for analyzing organic additives in an electroplating bathSHIPLEY CO·Filed 1991·Granted Jun 29, 1993·94 cites·19 claims
- 0485US7563315B2Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substratesOMG ELECTRONIC CHEMICALS INC·Filed 2006·Granted Jul 21, 2009·6 cites·9 claims
- 0585US5051154AAdditive for acid-copper electroplating baths to increase throwing powerSHIPLEY CO·Filed 1990·Granted Sep 24, 1991·67 cites·60 claims
- 0684US6946027B2Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substratesELECTROCHEMICALS INC·Filed 2004·Granted Sep 20, 2005·18 cites·46 claims
- 0783US2024158941A1Gold Plating Bath and Gold Plated Final FinishMACDERMID ENTHONE INC·Filed 2024·Application pending·0 cites
- 0879US6716281B2Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substratesELECTROCHEMICALS INC·Filed 2002·Granted Apr 6, 2004·19 cites·28 claims
- 0977US7351353B1Method for roughening copper surfaces for bonding to substratesELECTROCHEMICALS INC·Filed 2000·Granted Apr 1, 2008·19 cites·14 claims
- 1074US7767009B2Solution and process for improving the solderability of a metal surfaceOMG ELECTRONIC CHEMICALS INC·Filed 2005·Granted Aug 3, 2010·3 cites·23 claims
- 1172US7211204B2Additives to stop copper attack by alkaline etching agents such as ammonia and monoethanol amine (MEA)ELECTROCHEMICALS INC·Filed 2003·Granted May 1, 2007·8 cites·9 claims
- 1271US5068013AElectroplating composition and processSHIPLEY CO·Filed 1990·Granted Nov 26, 1991·34 cites·5 claims
- 1370US7591956B2Method and composition for selectively stripping nickel from a substrateOMG ELECTRONIC CHEMICALS INC·Filed 2006·Granted Sep 22, 2009·3 cites·21 claims
- 1469US4932518AMethod and apparatus for determining throwing power of an electroplating solutionSHIPLEY CO·Filed 1989·Granted Jun 12, 1990·25 cites·10 claims
- 1568US7153445B2Method for roughening copper surfaces for bonding to substratesELECTROCHEMICALS INC·Filed 2001·Granted Dec 26, 2006·11 cites·14 claims
- 1666US10986738B2Carbon-based direct plating processMACDERMID ENTHONE INC·Filed 2018·Granted Apr 20, 2021·0 cites·16 claims
- 1765US6623787B2Method to improve the stability of dispersions of carbonELECTROCHEMICALS INC·Filed 2001·Granted Sep 23, 2003·5 cites·14 claims
- 1865US2021371998A1Gold Plating Bath and Gold Plated Final FinishMACDERMID ENTHONE INC·Filed 2020·Application pending·0 cites
- 1964US5004525ACopper electroplating compositionSHIPLEY CO·Filed 1989·Granted Apr 2, 1991·12 cites·4 claims
- 2064US2021204412A1Carbon-Based Direct Plating ProcessMACDERMID ENTHONE INC·Filed 2021·Application pending·0 cites
- 2163US4897165AElectroplating composition and process for plating through holes in printed circuit boardsSHIPLEY CO·Filed 1988·Granted Jan 30, 1990·21 cites·16 claims
- 2256US2010006799A1Method and Composition for Selectively Stripping Nickel from a SubstrateOMG ELECTRONIC CHEMICALS INC·Filed 2009·Application pending·0 cites
- 2354US2022081776A1High Elongation Electroless Copper ProcessMACDERMID ENTHONE INC·Filed 2020·Application pending·0 cites
- 2454US2014299480A1Copper Plating Solutions and Method of Making and Using Such SolutionsBERNARDS ROGER·Filed 2014·Application pending·0 cites
- 2550US2006102879A1Methods to stop copper attach by alkaline etching agents such as ammonia and monoethanol amine (MEA)ELECTROCHEMICALS INC·Filed 2005·Application pending·0 cites
- 2650US2009198006A1Methods And Compositions For Depositing Silver Onto A Metal SurfaceBERNARDS ROGER F·Filed 2008·Application pending·0 cites
- 2747US8110252B2Solution and process for improving the solderability of a metal surfaceBERNARDS ROGER F·Filed 2010·Granted Feb 7, 2012·0 cites·17 claims
- 2847US2008011982A1A Method And Composition For Selectively Stripping Nickel From A SubstrateBERNARDS ROGER F·Filed 2007·Application pending·0 cites
- 2947US2006191869A1Method for roughening copper surfaces for bonding to substratesBERNARDS ROGER·Filed 2006·Application pending·0 cites
- 3044US2004077733A1Methods to stabilize a viscosity-unstable aqueous dispersion of carbonFiled 2003·Application pending·0 cites
- 3144US2004048486A1Method for roughening copper surfaces for bonding to substratesFiled 2003·Application pending·0 cites
- 3238US2003175441A1Apparatus and method for coating through holes of printed wiring boards with fluidFiled 2002·Application pending·0 cites
- 3333US5395652APlating catalyst formed from noble metal ions and bromide ionsSHIPLEY CO·Filed 1994·Granted Mar 7, 1995·3 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Roger Bernards files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →