Inventor · disambiguated record
Kyle K. Kirby
Also filed as: CHAINE MICHAEL · KIRBY KYLE · KIRBY KYLE K · KIRBY KYLE KENDRICK
213 granted patents·47 pending applications·3,954 citations·filing 1998–2025
99Inventor score
Top patents by PatentIndex Score
260 records- 0199US11817305B2Front end of line interconnect structures and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Nov 14, 2023·8 cites·19 claims
- 0299US8030780B2Semiconductor substrates with unitary vias and via terminals, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2008·Granted Oct 4, 2011·254 cites·13 claims
- 0399US7498675B2Semiconductor component having plate, stacked dice and conductive viasMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 3, 2009·292 cites·20 claims
- 0499US7109068B2Through-substrate interconnect fabrication methodsMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 19, 2006·143 cites·78 claims
- 0599US6841883B1Multi-dice chip scale semiconductor components and wafer level methods of fabricationMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 11, 2005·659 cites·71 claims
- 0698US11239169B1Semiconductor memory stacks connected to processing units and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 1, 2022·4 cites·20 claims
- 0798US7968460B2Semiconductor with through-substrate interconnectMICRON TECHNOLOGY INC·Filed 2008·Granted Jun 28, 2011·52 cites·17 claims
- 0898US7683458B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 23, 2010·54 cites·17 claims
- 0998US7411304B2Semiconductor interconnect having conductive spring contactsMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 12, 2008·63 cites·19 claims
- 1098US7078922B2Semiconductor interconnect having semiconductor spring contactsMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 18, 2006·54 cites·27 claims
- 1197US7759800B2Microelectronics devices, having vias, and packaged microelectronic devices having viasMICRON TECHNOLOGY INC·Filed 2006·Granted Jul 20, 2010·51 cites·22 claims
- 1297US7531453B2Microelectronic devices and methods for forming interconnects in microelectronic devicesMICRON TECHNOLOGY INC·Filed 2008·Granted May 12, 2009·45 cites·19 claims
- 1397US7495316B2Methods of forming conductive vias and methods of forming multichip modules including such conductive viasMICRON TECHNOLOGY INC·Filed 2007·Granted Feb 24, 2009·53 cites·20 claims
- 1497US7300857B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2004·Granted Nov 27, 2007·166 cites·32 claims
- 1597US7262134B2Microfeature workpieces and methods for forming interconnects in microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 28, 2007·59 cites·32 claims
- 1697US7091124B2Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devicesMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 15, 2006·114 cites·26 claims
- 1796US11289440B1Combination-bonded die pair packaging and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 29, 2022·3 cites·19 claims
- 1896US7829976B2Microelectronic devices and methods for forming interconnects in microelectronic devicesMICRON TECHNOLOGY INC·Filed 2009·Granted Nov 9, 2010·31 cites·22 claims
- 1996US7452743B2Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer levelAPTINA IMAGING CORP·Filed 2005·Granted Nov 18, 2008·52 cites·34 claims
- 2096US7314821B2Method for fabricating a semiconductor interconnect having conductive spring contactsMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 1, 2008·26 cites·15 claims
- 2196US7271482B2Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methodsMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 18, 2007·97 cites·65 claims
- 2296US7232754B2Microelectronic devices and methods for forming interconnects in microelectronic devicesMICRON TECHNOLOGY INC·Filed 2004·Granted Jun 19, 2007·84 cites·41 claims
- 2395US7956443B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2010·Granted Jun 7, 2011·16 cites·17 claims
- 2494US11862569B2Front end of line interconnect structures and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Jan 2, 2024·2 cites·11 claims
- 2594US7791184B2Image sensor packages and frame structure thereofMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 7, 2010·19 cites·41 claims
- 2694US7589008B2Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methodsMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 15, 2009·28 cites·18 claims
- 2794US7449910B2Test system for semiconductor components having conductive spring contactsMICRON TECHNOLOGY INC·Filed 2006·Granted Nov 11, 2008·19 cites·17 claims
- 2894US7129567B2Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elementsMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 31, 2006·75 cites·26 claims
- 2993US8404587B2Semiconductor with through-substrate interconnectKIRBY KYLE K·Filed 2011·Granted Mar 26, 2013·11 cites·15 claims
- 3093US8253230B2Disabling electrical connections using pass-through 3D interconnects and associated systems and methodsJANZEN JEFFERY W·Filed 2008·Granted Aug 28, 2012·22 cites·10 claims
- 3193US7919348B2Methods for protecting imaging elements of photoimagers during back side processingAPTINA IMAGING CORP·Filed 2008·Granted Apr 5, 2011·28 cites·16 claims
- 3293US7645635B2Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packagesMICRON TECHNOLOGY INC·Filed 2004·Granted Jan 12, 2010·61 cites·119 claims
- 3393US7528491B2Semiconductor components and assemblies including vias of varying lateral dimensionsMICRON TECHNOLOGY INC·Filed 2006·Granted May 5, 2009·23 cites·41 claims
- 3493US7355267B2Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elementsMICRON TECHNOLOGY INC·Filed 2006·Granted Apr 8, 2008·19 cites·21 claims
- 3593US7071098B2Methods of fabricating interconnects for semiconductor components including a through hole entirely through the component and forming a metal nitride including separate precursor cyclesMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 4, 2006·20 cites·19 claims
- 3692US10529592B2Semiconductor device assembly with pillar arrayMICRON TECHNOLOGY INC·Filed 2017·Granted Jan 7, 2020·7 cites·17 claims
- 3792US10134671B13D interconnect multi-die inductors with through-substrate via coresMICRON TECHNOLOGY INC·Filed 2017·Granted Nov 20, 2018·6 cites·12 claims
- 3892US7915736B2Microfeature workpieces and methods for forming interconnects in microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 29, 2011·21 cites·24 claims
- 3992US7598167B2Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structuresMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 6, 2009·20 cites·29 claims
- 4092US7459393B2Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contactsMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 2, 2008·58 cites·15 claims
- 4191US10121739B1Multi-die inductors with coupled through-substrate via coresMICRON TECHNOLOGY INC·Filed 2017·Granted Nov 6, 2018·6 cites·20 claims
- 4291US8084854B2Pass-through 3D interconnect for microelectronic dies and associated systems and methodsPRATT DAVID S·Filed 2007·Granted Dec 27, 2011·22 cites·13 claims
- 4391US7413979B2Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devicesMICRON TECHNOLOGY INC·Filed 2006·Granted Aug 19, 2008·16 cites·27 claims
- 4491US7060526B2Wafer level methods for fabricating multi-dice chip scale semiconductor componentsMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 13, 2006·96 cites·38 claims
- 4591US6250688B1Ramp-lock lifting deviceMICRON TECHNOLOGY INC·Filed 1998·Granted Jun 26, 2001·54 cites·11 claims
- 4690US9653420B2Microelectronic devices and methods for filling vias in microelectronic devicesMICRON TECHNOLOGY INC·Filed 2014·Granted May 16, 2017·6 cites·21 claims
- 4790US8859425B2Devices, systems, and methods related to forming through-substrate vias with sacrificial plugsMICRON TECHNOLOGY INC·Filed 2012·Granted Oct 14, 2014·10 cites·26 claims
- 4890US8503156B2Methods of processing semiconductor substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded theretoRAY DEWALI·Filed 2011·Granted Aug 6, 2013·15 cites·13 claims
- 4990US7409762B2Method for fabricating an interconnect for semiconductor componentsMICRON TECHNOLOGY INC·Filed 2006·Granted Aug 12, 2008·14 cites·22 claims
- 5090US7169248B1Methods for releasably attaching support members to microfeature workpieces and microfeature assemblies formed using such methodsMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 30, 2007·14 cites·38 claims
Showing the top 50 of 260 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →