Inventor · disambiguated record
Yana Cheng
Also filed as: CHENG YANA
15 granted patents·1 pending application·26 citations·filing 2014–2020
89Inventor score
Top patents by PatentIndex Score
16 records- 0190US11947266B2Method for controlling a manufacturing process and associated apparatusesASML NETHERLANDS BV·Filed 2019·Granted Apr 2, 2024·5 cites·20 claims
- 0287US12044980B2Method of manufacturing devicesASML NETHERLANDS BV·Filed 2019·Granted Jul 23, 2024·3 cites·20 claims
- 0382US11803127B2Method for determining root cause affecting yield in a semiconductor manufacturing processASML NETHERLANDS BV·Filed 2019·Granted Oct 31, 2023·3 cites·20 claims
- 0481US9601431B2Dielectric/metal barrier integration to prevent copper diffusionAPPLIED MATERIALS INC·Filed 2014·Granted Mar 21, 2017·4 cites·1 claims
- 0578US10109520B2Methods for depositing dielectric barrier layers and aluminum containing etch stop layersAPPLIED MATERIALS INC·Filed 2016·Granted Oct 23, 2018·2 cites·14 claims
- 0676US9984976B2Interconnect structures and methods of formationAPPLIED MATERIALS INC·Filed 2016·Granted May 29, 2018·2 cites·18 claims
- 0776US9633839B2Methods for depositing dielectric films via physical vapor deposition processesAPPLIED MATERIALS INC·Filed 2015·Granted Apr 25, 2017·2 cites·19 claims
- 0876US9299605B2Methods for forming passivation protection for an interconnection structureAPPLIED MATERIALS INC·Filed 2014·Granted Mar 29, 2016·3 cites·20 claims
- 0974US12055904B2Method to predict yield of a device manufacturing processASML NETHERLANDS BV·Filed 2019·Granted Aug 6, 2024·2 cites·20 claims
- 1063US11056325B2Methods and apparatus for substrate edge uniformityAPPLIED MATERIALS INC·Filed 2018·Granted Jul 6, 2021·0 cites·20 claims
- 1159US10707122B2Methods for depositing dielectric barrier layers and aluminum containing etch stop layersAPPLIED MATERIALS INC·Filed 2018·Granted Jul 7, 2020·0 cites·20 claims
- 1259US10546742B2Method to reduce trap-induced capacitance in interconnect dielectric barrier stackAPPLIED MATERIALS INC·Filed 2018·Granted Jan 28, 2020·0 cites·19 claims
- 1356US11754931B2Method for determining corrections for lithographic apparatusASML NETHERLANDS BV·Filed 2020·Granted Sep 12, 2023·0 cites·20 claims
- 1453US10170299B2Method to reduce trap-induced capacitance in interconnect dielectric barrier stackAPPLIED MATERIALS INC·Filed 2016·Granted Jan 1, 2019·0 cites·11 claims
- 1544US2022291590A1Modeling method for computational fingerprintsASML NETHERLANDS BV·Filed 2020·Application pending·0 cites
- 1643US10665426B2Methods for thin film material deposition using reactive plasma-free physical vapor depositionAPPLIED MATERIALS INC·Filed 2015·Granted May 26, 2020·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →