Inventor · disambiguated record
Hirokazu Noma
Also filed as: NOMA HIROKAZU
8 granted patents·6 pending applications·30 citations·filing 2006–2024
83Inventor score
Top patents by PatentIndex Score
14 records- 0191US9354408B2Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguideIBM·Filed 2013·Granted May 31, 2016·12 cites·5 claims
- 0281US7484293B2Semiconductor package and manufacturing method thereforIBM·Filed 2006·Granted Feb 3, 2009·10 cites·4 claims
- 0379US2025003902A1Method of measuring physical properties, method of evaluating member, method of manufacturing electronic component device, method of manufacturing material for electronic component device, and physical property measurement systemRESONAC CORP·Filed 2024·Application pending·0 cites
- 0478US9772462B2Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguideIBM·Filed 2016·Granted Sep 26, 2017·2 cites·10 claims
- 0576US9684237B2Circuit board formation using organic substratesIBM·Filed 2015·Granted Jun 20, 2017·2 cites·3 claims
- 0674US9698119B2Interfacial alloy layer for improving electromigration (EM) resistance in solder jointsIBM·Filed 2016·Granted Jul 4, 2017·2 cites·8 claims
- 0773US12130247B2Method of measuring physical properties, method of evaluating member, method of manufacturing electronic component device, method of manufacturing material for electronic component device, and physical property measurement systemSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Oct 29, 2024·0 cites·20 claims
- 0869US9391034B2Interfacial alloy layer for improving electromigration (EM) resistance in solder jointsIBM·Filed 2013·Granted Jul 12, 2016·2 cites·6 claims
- 0965US2025283793A1Reliability test method for printed wiring board substrateRESONAC CORP·Filed 2024·Application pending·0 cites
- 1054US2025112115A1Semiconductor package and semiconductor deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 1152US9760002B2Circuit board formation using organic substratesIBM·Filed 2015·Granted Sep 12, 2017·0 cites·7 claims
- 1250US2009047755A1Semiconductor package and manufacturing method thereforIBM·Filed 2008·Application pending·0 cites
- 1349US2025168975A1Core substrate for wiring boards and method for producing same, and wiring board and method for producing sameRESONAC CORP·Filed 2022·Application pending·0 cites
- 1448US2025385104A1Production method for semiconductor packagesRESONAC CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →