Inventor · disambiguated record
Toshimitsu Miyata
Also filed as: MIYATA TOSHIMITSU
10 granted patents·4 pending applications·471 citations·filing 1998–2009
88Inventor score
Files withHITACHI INT ELECTRIC INC5HAYASHIDA AKIRA2HITACHI LTD2HITACHI KOKUSAI ELECTRONIC INC1ISHISAKA MITSUNORI1
Top patents by PatentIndex Score
14 records- 0195US9111972B2Substrate processing apparatus and manufacturing method for a semiconductor deviceTAKESHITA MITSUNORI·Filed 2005·Granted Aug 18, 2015·443 cites·17 claims
- 0277US7842160B2Semiconductor producing device and semiconductor device producing methodHITACHI INT ELECTRIC INC·Filed 2008·Granted Nov 30, 2010·5 cites·9 claims
- 0369US8906161B2Semiconductor producing device and semiconductor device producing methodKASANAMI KATSUHISA·Filed 2009·Granted Dec 9, 2014·4 cites·14 claims
- 0468US7863204B2Substrate processing apparatus, heating apparatus for use in the same, method of manufacturing semiconductors with those apparatuses, and heating element supporting structureHITACHI INT ELECTRIC INC·Filed 2006·Granted Jan 4, 2011·3 cites·22 claims
- 0564US8197638B2Semiconductor manufacturing device and method for manufacturing semiconductor devicesISHISAKA MITSUNORI·Filed 2005·Granted Jun 12, 2012·3 cites·5 claims
- 0663US8116618B2Heating apparatus, substrate processing apparatus, and method of manufacturing semiconductor devicesHAYASHIDA AKIRA·Filed 2008·Granted Feb 14, 2012·2 cites·14 claims
- 0760US6288368B1Vacuum heating furnace with tapered portionHITACHI LTD·Filed 2000·Granted Sep 11, 2001·6 cites·6 claims
- 0858US9184069B2Heating apparatus, substrate processing apparatus employing the same, method of manufacturing semiconductor devices, and insulatorHAYASHIDA AKIRA·Filed 2008·Granted Nov 10, 2015·1 cites·18 claims
- 0948US6514869B2Method for use in manufacturing a semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2001·Granted Feb 4, 2003·2 cites·5 claims
- 1039US2006151117A1Semiconductor producing device and semiconductor producing methodHITACHI KOKUSAI ELECTRONIC INC·Filed 2004·Application pending·0 cites
- 1138US2003231698A1Apparatus and method for fabricating a semiconductor device and a heat treatment apparatusFiled 2003·Application pending·0 cites
- 1235US2002094600A1Substrate processing apparatus and method for manufacturing a semiconductor device employing sameHITACHI INT ELECTRIC INC·Filed 2002·Application pending·0 cites
- 1335US2002197145A1Substrate processing apparatus and a method for fabricating a semiconductor device by using sameHITACHI INT ELECTRIC INC·Filed 2002·Application pending·0 cites
- 1431US6093911AVacuum heating furnace with tapered portionHITACHI LTD·Filed 1998·Granted Jul 25, 2000·2 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →