Inventor · disambiguated record
Mayur Govind Kulkarni
Also filed as: KULKARNI MAYUR G · KULKARNI MAYUR GOVIND
20 granted patents·18 pending applications·48 citations·filing 2006–2025
91Inventor score
Top patents by PatentIndex Score
38 records- 0194US10490436B2Enhanced lift pin design to eliminate local thickness non-uniformity in teos oxide filmsAPPLIED MATERIALS INC·Filed 2016·Granted Nov 26, 2019·10 cites·16 claims
- 0288US10312076B2Application of bottom purge to increase clean efficiencyAPPLIED MATERIALS INC·Filed 2018·Granted Jun 4, 2019·5 cites·20 claims
- 0388US9538583B2Substrate support with switchable multizone heaterAPPLIED MATERIALS INC·Filed 2013·Granted Jan 3, 2017·9 cites·18 claims
- 0487US10600624B2System and method for substrate processing chambersAPPLIED MATERIALS INC·Filed 2018·Granted Mar 24, 2020·5 cites·22 claims
- 0586US10242890B2Substrate support with heaterVOLFOVSKI LEON·Filed 2011·Granted Mar 26, 2019·12 cites·20 claims
- 0679US10113231B2Process kit including flow isolator ringAPPLIED MATERIALS INC·Filed 2016·Granted Oct 30, 2018·1 cites·18 claims
- 0777US10612135B2Method and system for high temperature cleanAPPLIED MATERIALS INC·Filed 2017·Granted Apr 7, 2020·2 cites·20 claims
- 0877US2025346999A1Shaped showerhead for edge plasma modulationAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0976US11512391B2Process kit for a high throughput processing chamberAPPLIED MATERIALS INC·Filed 2020·Granted Nov 29, 2022·0 cites·20 claims
- 1075US11508611B2Enhanced lift pin design to eliminate local thickness non-uniformity in teos oxide filmsAPPLIED MATERIALS INC·Filed 2019·Granted Nov 22, 2022·1 cites·20 claims
- 1169US9706605B2Substrate support with feedthrough structureAPPLIED MATERIALS INC·Filed 2013·Granted Jul 11, 2017·2 cites·19 claims
- 1267US12338530B2Shaped showerhead for edge plasma modulationAPPLIED MATERIALS INC·Filed 2021·Granted Jun 24, 2025·0 cites·16 claims
- 1366US10199388B2VNAND tensile thick TEOS oxideAPPLIED MATERIALS INC·Filed 2016·Granted Feb 5, 2019·1 cites·10 claims
- 1463US10724138B2Process kit for a high throughput processing chamberAPPLIED MATERIALS INC·Filed 2018·Granted Jul 28, 2020·0 cites·19 claims
- 1561US2025037976A1Process stack for cvd plasma treatmentAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1660US2025391694A1Substrate supportAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1758US2025149373A1Soft touch coating materials for substrate handlingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1857US10017855B2Process kit for a high throughput processing chamberAPPLIED MATERIALS INC·Filed 2015·Granted Jul 10, 2018·0 cites·13 claims
- 1957US2025029849A1Shaped faceplate for extreme edge film uniformityAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2057US2024312770A1Apparatus and methods for controlling substrate temperature during processingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2157US2025069959A1Adaptive wafer bow managementAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2255US12119209B2Dynamic processing chamber baffleAPPLIED MATERIALS INC·Filed 2021·Granted Oct 15, 2024·0 cites·20 claims
- 2354US11929278B2Low impedance current path for edge non-uniformity tuningAPPLIED MATERIALS INC·Filed 2021·Granted Mar 12, 2024·0 cites·17 claims
- 2454US11869795B2Mesa height modulation for thickness correctionAPPLIED MATERIALS INC·Filed 2021·Granted Jan 9, 2024·0 cites·17 claims
- 2553US12040210B2Multi-pressure bipolar electrostatic chuckingAPPLIED MATERIALS INC·Filed 2020·Granted Jul 16, 2024·0 cites·20 claims
- 2653US10483282B2VNAND tensile thick TEOS oxideAPPLIED MATERIALS INC·Filed 2019·Granted Nov 19, 2019·0 cites·11 claims
- 2753US2019378696A1Apparatus for suppressing parasitic plasma in plasma enhanced chemical vapor deposition chamberAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 2851US2024234167A1Modular precursor delivery and splitting for fast switchingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2950US2019311887A1Multizone gas distribution apparatusAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 3044US2009001071A1Method and System for Cooling a Bake Plate in a Track Lithography ToolSOKUDO CO LTD·Filed 2007·Application pending·0 cites
- 3143US2023113063A1Dynamic processing chamber baffleAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 3242US2022122811A1Electric arc mitigating faceplateAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 3341US2021388495A1Asymmetric exhaust pumping plate design for a semiconductor processing chamberAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 3441US2022093368A1Wafer non-uniformity tweaking through localized ion enhanced plasma (iep)APPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 3540US2007207259A1Track lithography system with integrated photoresist pump, filter, and buffer vesselAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3638US12020907B2Faceplate with localized flow controlAPPLIED MATERIALS INC·Filed 2020·Granted Jun 25, 2024·0 cites·18 claims
- 3734US2013087309A1Substrate support with temperature controlVOLFOVSKI LEON·Filed 2011·Application pending·0 cites
- 3832US2012196242A1Substrate support with heater and rapid temperature changeVOLFOVSKI LEON·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →