Inventor · disambiguated record
Yasumasa Akatsuka
Also filed as: AKATSUKA YASUMASA
11 granted patents·12 pending applications·71 citations·filing 1996–2022
87Inventor score
Files withNIPPON KAYAKU KK13AKATSUKA YASUMASA3NAKANISHI MASATAKA2ISHIKAWA KAZUNORI1NAWROCKI DANIEL J1
Top patents by PatentIndex Score
23 records- 0176US7521100B2Liquid crystal sealing agent and liquid crystalline display cell using the sameNIPPON KAYAKU KK·Filed 2004·Granted Apr 21, 2009·18 cites·22 claims
- 0273US7608336B2Flame-retardant epoxy resin composition and cured product obtained therefromNIPPON KAYAKU KK·Filed 2005·Granted Oct 27, 2009·7 cites·22 claims
- 0372US6043333AModified epoxy resin, epoxy resin composition and cured product thereofNIPPON KAYAKU KK·Filed 1997·Granted Mar 28, 2000·32 cites·17 claims
- 0470US12391783B2Polymer compound, and resin composition containing said compoundNIPPON KAYAKU KK·Filed 2021·Granted Aug 19, 2025·0 cites·13 claims
- 0563US2024150512A1Resin Composition Including Curable Polymer CompoundNIPPON KAYAKU KK·Filed 2022·Application pending·0 cites
- 0655US12173120B2Random copolymer compound, terminal-modified polymer compound, and resin composition including said compoundsNIPPON KAYAKU KK·Filed 2019·Granted Dec 24, 2024·0 cites·3 claims
- 0755US9480154B2Polyamide resin, epoxy resin compositions, and cured articles thereofISHIKAWA KAZUNORI·Filed 2006·Granted Oct 25, 2016·0 cites·9 claims
- 0851US6812318B2Epoxy resins, epoxy resin mixtures, epoxy resin compositions and products of curing of the sameNIPPON KAYAKU KK·Filed 2001·Granted Nov 2, 2004·2 cites·5 claims
- 0948US11988963B2Low temperature cure photoimageable dielectric compositions and methods of their useNAWROCKI DANIEL J·Filed 2020·Granted May 21, 2024·0 cites·20 claims
- 1046US2008032154A1Epoxy Resin, Epoxy Resin Composition and Cured Product ThereofAKATSUKA YASUMASA·Filed 2005·Application pending·0 cites
- 1145US5780571ANaphthalene ring-containing resins, resin compositions and cured products thereofNIPPON KAYAKU KK·Filed 1997·Granted Jul 14, 1998·8 cites·14 claims
- 1245US2009054587A1Epoxy resin, epoxy resin composition, and prepreg and laminated plate using the epoxy resin compositionNIPPON KAYAKU KK·Filed 2006·Application pending·0 cites
- 1344US6723801B2Polyphenol resin, process for its production, epoxy resin composition and its useNIPPON KAYAKU KK·Filed 2001·Granted Apr 20, 2004·2 cites·1 claims
- 1444US2009056982A1Process for producing a double-sided flexible printed board and double-sided flexible printed boardAKATSUKA YASUMASA·Filed 2006·Application pending·0 cites
- 1542US2006058469A1Flame retardant epoxy resin composition and cured object obtained therefromAKATSUKA YASUMASA·Filed 2003·Application pending·0 cites
- 1642US2008153976A1Epoxy Resin, Epoxy Resin Composition, And Cured Material ThereofNIPPON KAYAKU KK·Filed 2005·Application pending·0 cites
- 1741US2008021173A1Epoxy Resin, Epoxy Resin Composition And Cured Product ThereofNAKANISHI MASATAKA·Filed 2005·Application pending·0 cites
- 1840US2012288725A1Heat-Resistant AdhesiveTANAKA RYUTARO·Filed 2011·Application pending·0 cites
- 1940US2008200636A1Epoxy Resin, Hardenable Resin Composition Containing the Same and Use ThereofNAKANISHI MASATAKA·Filed 2006·Application pending·0 cites
- 2037US2007161100A1Photosensitive resin composition and cured product thereofNIPPON KAYAKU KK·Filed 2005·Application pending·0 cites
- 2135US2004166326A1Polyphenol resin, method for producing the same, epoxy resin composition and use thereofFiled 2004·Application pending·0 cites
- 2230US5840824AEpoxy resin, epoxy resin composition and hardened product thereofNIPPON KAYAKU KK·Filed 1996·Granted Nov 24, 1998·2 cites·5 claims
- 2330US2012178332A1Fiber Comprising Heat Curable Polyamide Resin Composition, Nonwoven Fabric And Producing Method ThereofUCHIDA MAKOTO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →