US2004166326A1PendingUtilityA1

Polyphenol resin, method for producing the same, epoxy resin composition and use thereof

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Priority: Oct 5, 2000Filed: Feb 26, 2004Published: Aug 26, 2004
Est. expiryOct 5, 2020(expired)· nominal 20-yr term from priority
Inventors:Yasumasa AkatsukaToyofumi AsanoMasahiro ImaizumiKatsuhiko OshimiSyouichi Tomida
H10W 70/695C08L 63/00C08G 61/02Y10T428/31511C08G 8/10
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Claims

Abstract

An object of the present invention is to provide an epoxy resin composition which has high flexibility, can be molded to a thin membrane, and can become a noninflammable cured product. The present invention comprises a polyphenol compound obtained by reacting to condense phenol with bischloromethyl biphenyl or bismethoxymethyl biphenyl, removing unreacted phenol and then reacting with BCMB again, wherein the polyphenol compound has a weight-average molecular weight of 3,000 or more as determined by GPC, and using the polyphenol compound as an agent for curing an epoxy resin.

Claims

exact text as granted — not AI-modified
1 . A polyphenol resin represented by formula (1):  
       
         
           
           
               
               
           
         
       
       wherein, n is an average degree of polymerization calculated from the average molecular weight,  
       and having a weight-average molecular weight of 3,000 or more as determined by gel permeation chromatography (GPC, hereinafter same).  
     
     
         2 . An epoxy resin composition comprising (a) an epoxy resin having at least two epoxy groups in the molecule and (b) the polyphenol resin according to  claim 1 .  
     
     
         3 . The epoxy resin composition according to  claim 2 , wherein 
 said epoxy resin is represented by formula (a):                          wherein, m is an average degree of polymerization and a positive number.    
     
     
         4 . The epoxy resin composition according to  claim 2  or  3  further comprising a curing accelerator.  
     
     
         5 . A varnish comprising the polyphenol resin according to  claim 1  and a solvent.  
     
     
         6 . The varnish comprising the epoxy resin composition according to any one of claims  2 - 4  containing a solvent.  
     
     
         7 . A sheet comprising a layer formed by drying the varnish according to  claim 5  or  6  on the surface of a flat supporting substrate.  
     
     
         8 . The sheet according to  claim 7 , wherein said flat supporting substrate is a polyimide film.  
     
     
         9 . The sheet according to  claim 7 , wherein said flat supporting substrate is a metallic foil.  
     
     
         10 . The sheet according to  claim 7 , wherein said flat supporting substrate is a release film.  
     
     
         11 . A cured product obtained by curing the epoxy resin composition according to any one of claims  2 - 4 .  
     
     
         12 . A curing agent for an epoxy resin comprising the polyphenol resin according to  claim 1.

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