Inventor · disambiguated record
Dimitris Lymberopoulos
Also filed as: LYMBEROPOULOS DIMITRIS · LYMBEROPOULOS DIMITRIS P
12 granted patents·3 pending applications·578 citations·filing 1998–2007
94Inventor score
Files withAPPLIED MATERIALS INC14
Top patents by PatentIndex Score
15 records- 0194US6521080B2Method and apparatus for monitoring a process by employing principal component analysisAPPLIED MATERIALS INC·Filed 2001·Granted Feb 18, 2003·76 cites·16 claims
- 0290US6455437B1Method and apparatus for monitoring the process state of a semiconductor device fabrication processAPPLIED MATERIALS INC·Filed 1999·Granted Sep 24, 2002·111 cites·37 claims
- 0390US6413867B1Film thickness control using spectral interferometryAPPLIED MATERIALS INC·Filed 1999·Granted Jul 2, 2002·101 cites·17 claims
- 0489US6368975B1Method and apparatus for monitoring a process by employing principal component analysisAPPLIED MATERIALS INC·Filed 1999·Granted Apr 9, 2002·90 cites·14 claims
- 0589US6085688AMethod and apparatus for improving processing and reducing charge damage in an inductively coupled plasma reactorAPPLIED MATERIALS INC·Filed 1998·Granted Jul 11, 2000·52 cites·54 claims
- 0688US6247425B1Method and apparatus for improving processing and reducing charge damage in an inductively coupled plasma reactorAPPLIED MATERIALS INC·Filed 2000·Granted Jun 19, 2001·28 cites·25 claims
- 0782US6589869B2Film thickness control using spectral interferometryAPPLIED MATERIALS INC·Filed 2002·Granted Jul 8, 2003·26 cites·20 claims
- 0881US6625513B1Run-to-run control over semiconductor processing tool based upon mirror image targetAPPLIED MATERIALS INC·Filed 2000·Granted Sep 23, 2003·29 cites·12 claims
- 0978US6896763B2Method and apparatus for monitoring a process by employing principal component analysisFiled 2003·Granted May 24, 2005·18 cites·12 claims
- 1075US7006205B2Method and system for event detection in plasma processesAPPLIED MATERIALS INC·Filed 2002·Granted Feb 28, 2006·12 cites·15 claims
- 1175US6895293B2Fault detection and virtual sensor methods for tool fault monitoringAPPLIED MATERIALS INC·Filed 2001·Granted May 17, 2005·19 cites·19 claims
- 1268US7265382B2Method and apparatus employing integrated metrology for improved dielectric etch efficiencyAPPLIED MATERIALS INC·Filed 2002·Granted Sep 4, 2007·16 cites·10 claims
- 1349US2006246683A1Integrated equipment set for forming a low K dielectric interconnect on a substrateAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 1447US2009112520A1Self-aware semiconductor equipmentAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 1541US2004007325A1Integrated equipment set for forming a low K dielectric interconnect on a substrateAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →