Inventor · disambiguated record
Toshiharu Yanagida
Also filed as: YANAGIDA TOSHIHARU
40 granted patents·5 pending applications·1,509 citations·filing 1990–2014
98Inventor score
Files withSONY CORP42
Top patents by PatentIndex Score
45 records- 0197US6020271AManufacturing method of semiconductor deviceSONY CORP·Filed 1998·Granted Feb 1, 2000·264 cites·8 claims
- 0295US7664476B2Human body communication system and communication deviceSONY CORP·Filed 2006·Granted Feb 16, 2010·33 cites·15 claims
- 0394US6376917B1Semiconductor deviceSONY CORP·Filed 2000·Granted Apr 23, 2002·79 cites·8 claims
- 0493US6429096B1Method of making thinned, stackable semiconductor deviceSONY CORP·Filed 2000·Granted Aug 6, 2002·77 cites·16 claims
- 0589US6504241B1Stackable semiconductor device and method for manufacturing the sameSONY CORP·Filed 1999·Granted Jan 7, 2003·105 cites·5 claims
- 0688US7791587B2Input apparatus, information terminal apparatus, and mode switching methodSONY CORP·Filed 2004·Granted Sep 7, 2010·51 cites·4 claims
- 0786US5445712ADry etching methodSONY CORP·Filed 1993·Granted Aug 29, 1995·93 cites·19 claims
- 0885US5338399ADry etching methodSONY CORP·Filed 1992·Granted Aug 16, 1994·82 cites·14 claims
- 0984US6204558B1Two ball bumpSONY CORP·Filed 1999·Granted Mar 20, 2001·52 cites·7 claims
- 1082US7057683B2Guest-host liquid crystal element with removable polarizerSONY CORP·Filed 2004·Granted Jun 6, 2006·19 cites·1 claims
- 1182US6545355B2Semiconductor device and method of fabricating the sameSONY CORP·Filed 1999·Granted Apr 8, 2003·56 cites·2 claims
- 1281US6876412B2Guest-host liquid crystal element with removable polarizerSONY CORP·Filed 2002·Granted Apr 5, 2005·17 cites·4 claims
- 1380US6720742B2Light control device, method for driving same and pickup device using the light control deviceFiled 2001·Granted Apr 13, 2004·21 cites·14 claims
- 1480US5877078AMethod of manufacturing a semiconductor deviceSONY CORP·Filed 1998·Granted Mar 2, 1999·59 cites·8 claims
- 1577US7711961B2Electronic apparatus and authenticating methodSONY CORP·Filed 2004·Granted May 4, 2010·48 cites·23 claims
- 1676US5726097AMethod of forming multilevel interconnections using high density plasma metal cleanSONY CORP·Filed 1995·Granted Mar 10, 1998·50 cites·17 claims
- 1773US5376234ADry etching methodSONY CORP·Filed 1993·Granted Dec 27, 1994·50 cites·12 claims
- 1872US7492409B2Light controller and imaging apparatusSONY CORP·Filed 2003·Granted Feb 17, 2009·10 cites·14 claims
- 1970US5933752AMethod and apparatus for forming solder bumps for a semiconductor deviceSONY CORP·Filed 1997·Granted Aug 3, 1999·37 cites·21 claims
- 2068US7230598B2Electric dimming device and its driving methodSONY CORP·Filed 2002·Granted Jun 12, 2007·8 cites·36 claims
- 2168US6013580APreprocessing method of metal film forming processSONY CORP·Filed 1997·Granted Jan 11, 2000·30 cites·16 claims
- 2267US6791657B2Liquid crystal display having liquid crystal cell gap variationSONY CORP·Filed 2001·Granted Sep 14, 2004·10 cites·10 claims
- 2365US7480456B2Image pickup apparatus and recording methodSONY CORP·Filed 2003·Granted Jan 20, 2009·7 cites·12 claims
- 2465US5378653AMethod of forming aluminum based patternSONY CORP·Filed 1993·Granted Jan 3, 1995·32 cites·12 claims
- 2565US5376228ADry etching methodSONY CORP·Filed 1993·Granted Dec 27, 1994·36 cites·20 claims
- 2662US7078820B2Semiconductor apparatus and process of production thereofSONY CORP·Filed 2001·Granted Jul 18, 2006·9 cites·10 claims
- 2760US5888892AMetal layer pattern forming methodSONY CORP·Filed 1996·Granted Mar 30, 1999·25 cites·11 claims
- 2859US5866475AMethod of forming solder bumpsSONY CORP·Filed 1997·Granted Feb 2, 1999·23 cites·20 claims
- 2957US5591302AProcess for etching copper containing metallic film and for forming copper containing metallic wiringSONY CORP·Filed 1995·Granted Jan 7, 1997·17 cites·3 claims
- 3055USRE46147ESemiconductor device and method of fabricating the sameSONY CORP·Filed 2014·Granted Sep 13, 2016·0 cites·24 claims
- 3153US5160398AEtching method and apparatusSONY CORP·Filed 1990·Granted Nov 3, 1992·19 cites·13 claims
- 3250US5362350AMethod for etching in dry processSONY CORP·Filed 1993·Granted Nov 8, 1994·18 cites·14 claims
- 3349US5314575AEtching method and apparatusSONY CORP·Filed 1992·Granted May 24, 1994·15 cites·8 claims
- 3447US7486349B2Polymer network liquid crystal element with predetermined gap for dimming device having image processing, temperature detecting and pulse width control units thereforSONY CORP·Filed 2003·Granted Feb 3, 2009·0 cites·8 claims
- 3547US5505322AProcess for etching copper containing metallic film and forming copper containing metallic wiringSONY CORP·Filed 1995·Granted Apr 9, 1996·10 cites·4 claims
- 3646US6426273B1Preprocessing method of metal film forming processSONY CORP·Filed 1996·Granted Jul 30, 2002·11 cites·7 claims
- 3746US6281116B1Method of manufacturing a semiconductor deviceSONY CORP·Filed 1999·Granted Aug 28, 2001·12 cites·6 claims
- 3845US2010159645A1Semiconductor apparatus and process of production thereofSONY CORP·Filed 2010·Application pending·0 cites
- 3944US2007120243A1Assembly jig and manufacturing method of multilayer semiconductor deviceSONY CORP·Filed 2006·Application pending·0 cites
- 4042US5569627AProcess for etching copper containing metallic film and for forming copper containing metallic wiringSONY CORP·Filed 1995·Granted Oct 29, 1996·7 cites·3 claims
- 4141US5419809ADry etching methodSONY CORP·Filed 1994·Granted May 30, 1995·11 cites·13 claims
- 4239US2002048916A1Thinned, stackable semiconductor device having low profileFiled 2001·Application pending·0 cites
- 4337US5918144AMethod of manufacturing a semiconductor deviceSONY CORP·Filed 1997·Granted Jun 29, 1999·6 cites·20 claims
- 4436US2002152610A1Electronic circuit device and method of production of the sameSONY CORP·Filed 2002·Application pending·0 cites
- 4532US2002017709A1Assembly jig and manufacturing method of multilayer semiconductor deviceFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →