Inventor · disambiguated record
Wai Mon Ma
Also filed as: MA WAI · MA WAI M · MA WAI MON
20 granted patents·6 pending applications·428 citations·filing 1988–2013
96Inventor score
Top patents by PatentIndex Score
26 records- 0191US7199309B2Structure for repairing or modifying surface connections on circuit boardsIBM·Filed 2005·Granted Apr 3, 2007·19 cites·11 claims
- 0291US4953929AFiber optic connector assembly and adapter for use therewithIBM·Filed 1989·Granted Sep 4, 1990·108 cites·23 claims
- 0387US9459285B2Test probe coated with conductive elastomer for testing of backdrilled plated through holes in printed circuit board assemblyGLOBALFOUNDRIES INC·Filed 2013·Granted Oct 4, 2016·6 cites·7 claims
- 0485US6784377B2Method and structure for repairing or modifying surface connections on circuit boardsIBM·Filed 2002·Granted Aug 31, 2004·25 cites·2 claims
- 0576US5872400AHigh melting point solder ball coated with a low melting point solderIBM·Filed 1997·Granted Feb 16, 1999·54 cites·10 claims
- 0675US6912780B2Method and structure for repairing or modifying surface connections on circuit boardsIBM·Filed 2004·Granted Jul 5, 2005·14 cites·8 claims
- 0774US7841078B2Method of optimizing land grid array geometryIBM·Filed 2008·Granted Nov 30, 2010·6 cites·7 claims
- 0871US6050481AMethod of making a high melting point solder ball coated with a low melting point solderIBM·Filed 1997·Granted Apr 18, 2000·34 cites·22 claims
- 0970US8638564B2Dye-based circuit mount testingBUSCHEL DANIEL J·Filed 2011·Granted Jan 28, 2014·3 cites·20 claims
- 1070US4907975AElectrical connector utilizing flexible electrical circuitryIBM·Filed 1988·Granted Mar 13, 1990·31 cites·10 claims
- 1167US6182884B1Method and apparatus for reworking ceramic ball grid array or ceramic column grid array on circuit cardsIBM·Filed 1998·Granted Feb 6, 2001·28 cites·7 claims
- 1266US5909011AMethod and apparatus for modifying circuit having ball grid array interconnectionsIBM·Filed 1996·Granted Jun 1, 1999·22 cites·14 claims
- 1365US6511347B2Terminating floating signals on a BGA module to a ground plane on a ball grid array (BGA) circuit board siteIBM·Filed 2001·Granted Jan 28, 2003·13 cites·9 claims
- 1464US5890284AMethod for modifying circuit having ball grid array interconnectionsIBM·Filed 1997·Granted Apr 6, 1999·21 cites·12 claims
- 1559US8902605B2Adapter for plated through hole mounting of surface mount componentBUSCHEL DANIEL J·Filed 2012·Granted Dec 2, 2014·1 cites·21 claims
- 1657US6974071B2Inclined solder wave methodology for wave soldering double sided pin-in-hole electronic componentsIBM·Filed 2003·Granted Dec 13, 2005·8 cites·14 claims
- 1756US6059172AMethod for establishing electrical communication between a first object having a solder ball and a second objectIBM·Filed 1997·Granted May 9, 2000·23 cites·7 claims
- 1855US2015178651A1Supply chain risk assessmentIBM·Filed 2013·Application pending·0 cites
- 1954US6437252B2Method and structure for reducing power noiseIBM·Filed 2000·Granted Aug 20, 2002·6 cites·18 claims
- 2044US2012298406A1Reduced stress gull wing solder joints for printed wiring board connectionsMA WAI MON·Filed 2011·Application pending·0 cites
- 2143US2009111299A1Surface Mount Array Connector Leads Planarization Using Solder Reflow MethodIBM·Filed 2007·Application pending·0 cites
- 2235US2006202001A1Enhanced heat system for bga/cga reworkIBM·Filed 2005·Application pending·0 cites
- 2335US2002166696A1Land grid array (LGA) pad repair structure and methodIBM·Filed 2001·Application pending·0 cites
- 2435US2005174738A1Method and structure for heat sink attachment in semiconductor device packagingIBM·Filed 2004·Application pending·0 cites
- 2534US6016947ANon-destructive low melt test for off-composition solderIBM·Filed 1997·Granted Jan 25, 2000·6 cites·20 claims
- 2633US8939791B2Primary circuit board non-conductive void having different planar dimensions through board thickness to secure non-conducting locking member of holderIBM·Filed 2013·Granted Jan 27, 2015·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →