Inventor · disambiguated record
Chun-Tsen Lu
Also filed as: LU CHUN-TSEN
26 granted patents·6 pending applications·57 citations·filing 2004–2024
94Inventor score
Top patents by PatentIndex Score
32 records- 0193US10043807B1Semiconductor device and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 7, 2018·9 cites·19 claims
- 0293US9379242B1Method of fabricating fin field effect transistorUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jun 28, 2016·13 cites·16 claims
- 0391US10043718B1Method of fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 7, 2018·9 cites·15 claims
- 0489US10153210B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Dec 11, 2018·5 cites·12 claims
- 0587US11631753B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Apr 18, 2023·3 cites·4 claims
- 0686US9887158B1Conductive structure having an entrenched high resistive layerUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 6, 2018·5 cites·11 claims
- 0783US10475744B2Vertical gate-all-around transistor and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Nov 12, 2019·3 cites·14 claims
- 0883US2025008743A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0982US2024282843A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1081US12009409B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Jun 11, 2024·0 cites·4 claims
- 1180US12336209B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Jun 17, 2025·0 cites·6 claims
- 1280US12127413B2Magnetoresistive random access memory and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Oct 22, 2024·0 cites·9 claims
- 1379US9966263B1Method of fabricating fin structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 8, 2018·3 cites·16 claims
- 1476US9735015B1Fabricating method of semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 15, 2017·2 cites·19 claims
- 1574US9502303B2Method for manufacturing semiconductor device with a barrier layer having overhung portionsUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 22, 2016·2 cites·19 claims
- 1672US10446448B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 15, 2019·1 cites·5 claims
- 1770US11004897B2Magnetoresistive random access memory and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted May 11, 2021·0 cites·7 claims
- 1866US11621296B2Magnetoresistive random access memory and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Apr 4, 2023·0 cites·9 claims
- 1966US9443726B1Semiconductor processUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 13, 2016·1 cites·20 claims
- 2062US9466484B1Manufacturing method of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Oct 11, 2016·1 cites·20 claims
- 2160US10403715B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Sep 3, 2019·0 cites·9 claims
- 2258US2025315586A1Deep trench capacitor layoutUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2355US10290723B2Semiconductor device with metal gateUNITED MICROELECTRONICS CORP·Filed 2018·Granted May 14, 2019·0 cites·7 claims
- 2455US2024339331A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2554US10204986B1Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 12, 2019·0 cites·11 claims
- 2653US10192826B2Conductive layout structure including high resistive layerUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 29, 2019·0 cites·8 claims
- 2752US10008581B2Semiconductor device having metal gate with nitrogen rich portion and titanium rich portionUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jun 26, 2018·0 cites·7 claims
- 2851US2024313046A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2949US11145733B1Method of manufacturing a semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2020·Granted Oct 12, 2021·0 cites·19 claims
- 3047US2016351674A1Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 3146US9443952B2Method of forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2014·Granted Sep 13, 2016·0 cites·20 claims
- 3246US6969900B2Semiconductor diode capable of detecting hydrogen at high temperaturesUNIV NAT CHENG KUNG·Filed 2004·Granted Nov 29, 2005·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →