Inventor · disambiguated record
Tatsumi Kusaba
Also filed as: KUSABA TATSUMI
16 granted patents·2 pending applications·144 citations·filing 2005–2010
92Inventor score
Files withSUMCO CORP18
Top patents by PatentIndex Score
18 records- 0195US7354844B2Method for manufacturing SOI substrateSUMCO CORP·Filed 2006·Granted Apr 8, 2008·43 cites·9 claims
- 0293US7718509B2Method for producing bonded waferSUMCO CORP·Filed 2009·Granted May 18, 2010·26 cites·3 claims
- 0390US7763541B2Process for regenerating layer transferred waferSUMCO CORP·Filed 2006·Granted Jul 27, 2010·19 cites·15 claims
- 0490US7442623B2Method for manufacturing bonded substrate and bonded substrate manufactured by the methodSUMCO CORP·Filed 2006·Granted Oct 28, 2008·17 cites·13 claims
- 0586US7364984B2Method for manufacturing SOI substrateSUMCO CORP·Filed 2007·Granted Apr 29, 2008·12 cites·8 claims
- 0679US7416960B2Method for manufacturing SOI substrateSUMCO CORP·Filed 2007·Granted Aug 26, 2008·7 cites·7 claims
- 0778US7767549B2Method of manufacturing bonded waferSUMCO CORP·Filed 2007·Granted Aug 3, 2010·8 cites·7 claims
- 0875US7541663B2P-type silicon wafer and method for heat-treating the sameSUMCO CORP·Filed 2005·Granted Jun 2, 2009·4 cites·6 claims
- 0974US7311775B2Method for heat-treating silicon wafer and silicon waferSUMCO CORP·Filed 2005·Granted Dec 25, 2007·2 cites·4 claims
- 1067US7601227B2High purification method of jig for semiconductor heat treatmentSUMCO CORP·Filed 2005·Granted Oct 13, 2009·2 cites·2 claims
- 1162US7939441B2P-type silicon wafer and method for heat-treating the sameSUMCO CORP·Filed 2009·Granted May 10, 2011·1 cites·1 claims
- 1262US7927972B2Method for producing bonded waferSUMCO CORP·Filed 2009·Granted Apr 19, 2011·1 cites·4 claims
- 1358US7534728B2Process for cleaning silicon substrateSUMCO CORP·Filed 2006·Granted May 19, 2009·1 cites·6 claims
- 1457US8003494B2Method for producing a bonded waferSUMCO CORP·Filed 2008·Granted Aug 23, 2011·1 cites·2 claims
- 1548US2010144119A1Method of producing bonded waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 1647US7927957B2Method for producing bonded silicon waferSUMCO CORP·Filed 2009·Granted Apr 19, 2011·0 cites·8 claims
- 1745US2010184270A1Method for Producing Bonded WaferSUMCO CORP·Filed 2010·Application pending·0 cites
- 1843US7745306B2Method for producing bonded waferSUMCO CORP·Filed 2007·Granted Jun 29, 2010·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →