Inventor · disambiguated record
Hideki Nishihata
Also filed as: NISHIHATA HIDEKI
17 granted patents·8 pending applications·88 citations·filing 2004–2010
92Inventor score
Top patents by PatentIndex Score
25 records- 0193US7713842B2Method for producing bonded waferSUMCO CORP·Filed 2008·Granted May 11, 2010·31 cites·4 claims
- 0284US7960225B1Method of controlling film thinning of semiconductor wafer for solid-state image sensing deviceSUMCO CORP·Filed 2010·Granted Jun 14, 2011·4 cites·6 claims
- 0374US7858494B2Laminated substrate manufacturing method and laminated substrate manufactured by the methodSUMCO CORP·Filed 2006·Granted Dec 28, 2010·6 cites·4 claims
- 0474US7851337B2Method for producing semiconductor substrateSUMCO CORP·Filed 2007·Granted Dec 14, 2010·5 cites·3 claims
- 0570US7410877B2Method for manufacturing SIMOX wafer and SIMOX waferSUMCO CORP·Filed 2006·Granted Aug 12, 2008·5 cites·10 claims
- 0668US7507641B2Method of producing bonded waferSUMCO CORP·Filed 2007·Granted Mar 24, 2009·4 cites·3 claims
- 0767US7951692B2Method of producing semiconductor substrate having an SOI structureSUMCO CORP·Filed 2008·Granted May 31, 2011·3 cites·2 claims
- 0863US7795117B2Method of producing semiconductor substrate having an SOI structureSUMCO CORP·Filed 2007·Granted Sep 14, 2010·2 cites·9 claims
- 0960US7625808B2Method for manufacturing bonded waferSUMCO CORP·Filed 2004·Granted Dec 1, 2009·9 cites·4 claims
- 1058US7534728B2Process for cleaning silicon substrateSUMCO CORP·Filed 2006·Granted May 19, 2009·1 cites·6 claims
- 1157US8003494B2Method for producing a bonded waferSUMCO CORP·Filed 2008·Granted Aug 23, 2011·1 cites·2 claims
- 1256US7510948B2Method for producing SOI waferSUMCO CORP·Filed 2004·Granted Mar 31, 2009·7 cites·5 claims
- 1354US7563697B2Method for producing SOI waferSUMCO CORP·Filed 2004·Granted Jul 21, 2009·6 cites·5 claims
- 1453US7358147B2Process for producing SOI waferSUMCO CORP·Filed 2004·Granted Apr 15, 2008·4 cites·4 claims
- 1551US2009023272A1Method of producing bonded waferSUMCO CORP·Filed 2008·Application pending·0 cites
- 1649US2010178750A1Method for producing bonded waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 1749US2007298589A1Method of producing bonded waferSUMCO CORP·Filed 2007·Application pending·0 cites
- 1848US8183133B2Method for producing semiconductor substrateMURAKAMI SATOSHI·Filed 2010·Granted May 22, 2012·0 cites·4 claims
- 1947US7927957B2Method for producing bonded silicon waferSUMCO CORP·Filed 2009·Granted Apr 19, 2011·0 cites·8 claims
- 2047US2009186464A1Method for producing bonded waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 2144US2009117708A1Method for manufacturing soi substrateSUMCO CORP·Filed 2007·Application pending·0 cites
- 2244US2008061452A1Bonded wafer and method of manufacturing the sameSUMCO CORP·Filed 2007·Application pending·0 cites
- 2342US7485874B2Apparatus for manufacturing semiconductor substratesSUMCO CORP·Filed 2006·Granted Feb 3, 2009·0 cites·14 claims
- 2438US2007069335A1Bonded wafer and its manufacturing methodENDO AKIHIKO·Filed 2004·Application pending·0 cites
- 2536US2011084367A1Epitaxial wafer and method of producing the sameSUMCO CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →