Inventor · disambiguated record
Shinsuke Hagiwara
Also filed as: HAGIWARA SHINSUKE
21 granted patents·2 pending applications·1,130 citations·filing 1992–2008
96Inventor score
Top patents by PatentIndex Score
23 records- 0198US5976912AFabrication process of semiconductor package and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 1995·Granted Nov 2, 1999·519 cites·4 claims
- 0297US5449480AMethod of producing boards for printed wiringHITACHI CHEMICAL CO LTD·Filed 1993·Granted Sep 12, 1995·182 cites·20 claims
- 0394US7637571B2Vehicle seat assemblyNHK SPRING CO LTD·Filed 2008·Granted Dec 29, 2009·49 cites·6 claims
- 0494US7187072B2Fabrication process of semiconductor package and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2003·Granted Mar 6, 2007·52 cites·9 claims
- 0592US7544727B2Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphateHITACHI CHEMICAL CO LTD·Filed 2005·Granted Jun 9, 2009·31 cites·26 claims
- 0691US6365432B1Fabrication process of semiconductor package and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2000·Granted Apr 2, 2002·41 cites·4 claims
- 0787US6746897B2Fabrication process of semiconductor package and semiconductor packageFiled 2001·Granted Jun 8, 2004·27 cites·14 claims
- 0883US6235842B1Phase-separated carboxyl group-containing elastomer modified phoenoxy resin optionally with epoxy resinHITACHI CHEMICAL CO LTD·Filed 1997·Granted May 22, 2001·71 cites·24 claims
- 0977US7397139B2Epoxy resin molding material for sealing use and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2004·Granted Jul 8, 2008·33 cites·25 claims
- 1072US7981977B2Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic fillerHITACHI CHEMICAL CO LTD·Filed 2006·Granted Jul 19, 2011·6 cites·10 claims
- 1172US6713589B2Phenyl, naphthly or fluorene cyclopentyl epoxy resinsHITACHI CHEMICAL CO LTD·Filed 2001·Granted Mar 30, 2004·17 cites·17 claims
- 1261US5319005AEpoxy resin molding material for sealing of electronic componentHITACHI CHEMICAL CO LTD·Filed 1992·Granted Jun 7, 1994·32 cites·9 claims
- 1359US5206333AMethod of producing a naphthol-modified phenolic resin of highly increased molecular weightHITACHI CHEMICAL CO LTD·Filed 1992·Granted Apr 27, 1993·13 cites·17 claims
- 1456US8232355B2Liquid resin composition for electronic components and electronic component deviceTAKAHASHI HISATO·Filed 2006·Granted Jul 31, 2012·3 cites·24 claims
- 1551US5739217AEpoxy resin molding for sealing electronic parts containing organic polymer-grafted siliconeHITACHI CHEMICAL CO LTD·Filed 1995·Granted Apr 14, 1998·15 cites·24 claims
- 1647US7982322B2Liquid resin composition for electronic part sealing, and electronic part apparatus utilizing the sameHITACHI CHEMICAL CO LTD·Filed 2007·Granted Jul 19, 2011·0 cites·16 claims
- 1745US5962139ASemiconductor sealant of epoxy resin and organic polymer-grafted silicone polymerHITACHI CHEMICAL CO LTD·Filed 1998·Granted Oct 5, 1999·11 cites·25 claims
- 1843US5459223AMethod of preparing naphthol-modified phenolic resinHITACHI CHEMICAL CO LTD·Filed 1994·Granted Oct 17, 1995·11 cites·9 claims
- 1941US2002094606A1Fabrication process of semiconductor package and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2002·Application pending·0 cites
- 2039US6207789B1Phenolic resin, resin composition, molding material for encapsulation, and electronic component deviceHITACHI CHEMICAL CO LTD·Filed 1998·Granted Mar 27, 2001·9 cites·20 claims
- 2137US6329492B1Phenyl, naphthyl or fluorene cyclopentyl epoxy resinsHITACHI CHEMICAL CO LTD·Filed 1997·Granted Dec 11, 2001·6 cites·15 claims
- 2236US2003201548A1Epoxy resin molding material for sealingFiled 2001·Application pending·0 cites
- 2332US5510446AMethod of preparing naphthol-modified phenolic resin and epoxy resin molding material for sealing electronic partsHITACHI CHEMICAL CO LTD·Filed 1995·Granted Apr 23, 1996·2 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →