Inventor · disambiguated record
Jay Scott Salmon
Also filed as: SALMON JAY · SALMON JAY R · SALMON JAY S · SALMON JAY SCOTT
15 granted patents·8 pending applications·78 citations·filing 2005–2024
89Inventor score
Top patents by PatentIndex Score
23 records- 0196US9319799B2Microphone package with integrated substrateBOSCH GMBH ROBERT·Filed 2013·Granted Apr 19, 2016·44 cites·6 claims
- 0291US9002038B2MEMS microphone package with molded interconnect deviceBOSCH GMBH ROBERT·Filed 2013·Granted Apr 7, 2015·22 cites·20 claims
- 0379US11721639B2Multi-component modules (MCMs) including configurable electro-magnetic isolation (EMI) shield structures, and related methodsQUALCOMM INC·Filed 2021·Granted Aug 8, 2023·1 cites·39 claims
- 0478US11985804B2Package comprising a block device with a shield and method of fabricating the sameQUALCOMM INC·Filed 2021·Granted May 14, 2024·1 cites·27 claims
- 0574US9661421B2Microphone package with molded spacerBOSCH GMBH ROBERT·Filed 2015·Granted May 23, 2017·2 cites·26 claims
- 0673US9238579B2Cavity package designBOSCH GMBH ROBERT·Filed 2013·Granted Jan 19, 2016·3 cites·14 claims
- 0772US10057688B2Lead frame-based chip carrier used in the fabrication of MEMS transducer packagesBOSCH GMBH ROBERT·Filed 2015·Granted Aug 21, 2018·2 cites·12 claims
- 0871US9961452B2MEMS microphone packageBOSCH GMBH ROBERT·Filed 2015·Granted May 1, 2018·2 cites·19 claims
- 0967US12100669B2Multi-component modules (MCMs) including configurable electromagnetic isolation (EMI) shield structures and related methodsQUALCOMM INC·Filed 2023·Granted Sep 24, 2024·0 cites·32 claims
- 1063US9641940B2Metalized microphone lid with integrated wire bonding shelfBOSCH GMBH ROBERT·Filed 2015·Granted May 2, 2017·1 cites·11 claims
- 1155US2025316612A1Trench shielding with photoimageable dielectric (pid) materialQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1252US9894444B2Microphone package with molded spacerBOSCH GMBH ROBERT·Filed 2017·Granted Feb 13, 2018·0 cites·19 claims
- 1352US2017113926A1Mems chip scale packageBOSCH GMBH ROBERT·Filed 2016·Application pending·0 cites
- 1451US12100649B2Package comprising an integrated device with a back side metal layerQUALCOMM INC·Filed 2021·Granted Sep 24, 2024·0 cites·34 claims
- 1551US2024396227A1Antenna module having antenna in mold layer, and related fabrication methodsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1650US10028068B2Metalized microphone lid with integrated wire bonding shelfBOSCH GMBH ROBERT·Filed 2017·Granted Jul 17, 2018·0 cites·10 claims
- 1745US10160637B2Molded lead frame package with embedded dieBOSCH GMBH ROBERT·Filed 2014·Granted Dec 25, 2018·0 cites·12 claims
- 1845US2013147040A1Mems chip scale packageOCHS ERIC·Filed 2011·Application pending·0 cites
- 1944US2016137490A1Cavity package designBOSCH GMBH ROBERT·Filed 2016·Application pending·0 cites
- 2043US2007031769A1Automatic candle snufferBURTON DAVID·Filed 2005·Application pending·0 cites
- 2140US2023070275A1Package comprising a substrate with a pad interconnect comprising a protrusionQUALCOMM INC·Filed 2021·Application pending·0 cites
- 2236US2017330677A1Space transformers, planarization layers for space transformers, methods of fabricating space transformers, and methods of planarizing space transformersCASCADE MICROTECH INC·Filed 2016·Application pending·0 cites
- 2335US10120020B2Probe head assemblies and probe systems for testing integrated circuit devicesCASCADE MICROTECH INC·Filed 2016·Granted Nov 6, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →