Cavity package design

Abstract

A semiconductor device. The device including a substrate having electrical traces, at least one of a MEMS die and a semiconductor chip mounted on the substrate, and a spacer. The spacer has a first end connected to the substrate and includes electrical interconnects coupled to the electrical traces. The at least one MEMS die and a semiconductor chip are contained within the spacer. The spacer and substrate form a cavity which contains the at least one MEMS die and a semiconductor chip. The cavity forms an acoustic volume when the semiconductor device is mounted to a circuit board via a second end of the spacer.

What is claimed is: 
     
         1 . A semiconductor device, the device comprising:
 a substrate having electrical traces;   at least one of a MEMS die and a semiconductor chip mounted on the substrate; and   a spacer having a first end connected to the substrate and including electrical interconnects coupled to the electrical traces, the at least one MEMS die and a semiconductor chip contained within the spacer;   wherein the spacer and substrate form a cavity which contains the at least one MEMS die and a semiconductor chip, the cavity forming an acoustic volume when the semiconductor device is mounted to a circuit board via a second end of the spacer, the second end opposite the first end.