Inventor · disambiguated record
Samuel Tam
Also filed as: TAM SAMUEL · TAM SAMUEL W · TAM SAMUEL WAISING
34 granted patents·15 pending applications·355 citations·filing 2001–2024
97Inventor score
Top patents by PatentIndex Score
49 records- 0198US9241097B1Camera module including image sensor die in molded cavity substrateAMAZON TECH INC·Filed 2013·Granted Jan 19, 2016·57 cites·20 claims
- 0297US9088705B1Camera module package with stiffener-mounted image sensor dieAMAZON TECH INC·Filed 2013·Granted Jul 21, 2015·32 cites·20 claims
- 0396US9167161B1Camera module package with a folded substrate and laterally positioned componentsAMAZON TECH INC·Filed 2013·Granted Oct 20, 2015·21 cites·21 claims
- 0495US9838599B1Multiple camera alignment system with rigid substratesAMAZON TECH INC·Filed 2015·Granted Dec 5, 2017·18 cites·20 claims
- 0595US7796187B2Wafer based camera module and method of manufactureFLEXTRONICS AP LLC·Filed 2005·Granted Sep 14, 2010·35 cites·46 claims
- 0694US9276140B1Imager module with interposer chipAMAZON TECH INC·Filed 2014·Granted Mar 1, 2016·16 cites·16 claims
- 0793US9838600B1Multiple camera alignment system with flexible substrates and stiffener membersAMAZON TECH INC·Filed 2015·Granted Dec 5, 2017·13 cites·20 claims
- 0893US9706092B1Imager module with castellated interposer chipAMAZON TECH INC·Filed 2015·Granted Jul 11, 2017·12 cites·20 claims
- 0989US10925160B1Electronic device with a display assembly and silicon circuit board substrateAMAZON TECH INC·Filed 2016·Granted Feb 16, 2021·7 cites·23 claims
- 1089US8092102B2Camera module with premolded lens housing and method of manufactureSHANGGUAN DONGKAI·Filed 2006·Granted Jan 10, 2012·22 cites·11 claims
- 1188US9848111B1Imager module with molded packagingAMAZON TECH INC·Filed 2015·Granted Dec 19, 2017·7 cites·20 claims
- 1288US9681032B1Imager module with molded packagingAMAZON TECH INC·Filed 2015·Granted Jun 13, 2017·7 cites·20 claims
- 1387US9204025B1Camera module with a molded enclosure contained in a flexible substrateAMAZON TECH INC·Filed 2013·Granted Dec 1, 2015·6 cites·18 claims
- 1487US7684689B2External adjustment mechanism for a camera lens and electronic imagerFLEXTRONICS INT USA INC·Filed 2005·Granted Mar 23, 2010·14 cites·125 claims
- 1586US9514925B1Protective coating for silicon substrateAMAZON TECH INC·Filed 2015·Granted Dec 6, 2016·6 cites·20 claims
- 1684US6737295B2Chip scale package with flip chip interconnectCHIPPAC INC·Filed 2002·Granted May 18, 2004·34 cites·14 claims
- 1780US8642387B2Method of fabricating stacked packages using laser direct structuringTAM SAMUEL·Filed 2011·Granted Feb 4, 2014·7 cites·8 claims
- 1879US8430579B2Camera module with molded tape flip chip imager mount and method of manufactureTAM SAMUEL WAISING·Filed 2011·Granted Apr 30, 2013·8 cites·57 claims
- 1979US8385073B2Folded system-in-package with heat spreaderFLEXTRONICS AP LLC·Filed 2010·Granted Feb 26, 2013·6 cites·11 claims
- 2078US9419032B2Wafer level camera module with molded housing and method of manufacturingSINGH HARPUNEET·Filed 2009·Granted Aug 16, 2016·5 cites·25 claims
- 2174US9136289B2Camera module housing having built-in conductive traces to accommodate stacked dies using flip chip connectionsTAM SAMUEL·Filed 2011·Granted Sep 15, 2015·4 cites·21 claims
- 2273US10069018B1Camera assembly with embedded components and redistribution layer interconnectsAMAZON TECH INC·Filed 2016·Granted Sep 4, 2018·2 cites·23 claims
- 2373US7872686B2Integrated lens and chip assembly for a digital cameraFLEXTRONICS INT USA INC·Filed 2004·Granted Jan 18, 2011·10 cites·74 claims
- 2470US9793316B1Imager module with interposer chipAMAZON TECH INC·Filed 2016·Granted Oct 17, 2017·1 cites·19 claims
- 2568US12149803B1Camera module with a folded flexible interconnect tape packageMETA PLATFORMS TECH LLC·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
- 2667US8477239B2Integrated lens and chip assembly for a digital cameraKALE VIDYADHAR SITARAM·Filed 2011·Granted Jul 2, 2013·2 cites·32 claims
- 2765US8119450B2Interconnecting a chip and a substrate by bonding pure metal bumps and pure metal spotsAHMAD NAZIR·Filed 2009·Granted Feb 21, 2012·2 cites·18 claims
- 2863US2025159319A1Electro-magnetic interference shielding for camera moduleMETA PLATFORMS TECH LLC·Filed 2024·Application pending·0 cites
- 2960US9018749B2Stacked packages using laser direct structuringFLEXTRONICS AP LLC·Filed 2014·Granted Apr 28, 2015·1 cites·12 claims
- 3056US12316929B2Camera module on flexible interconnect tapeMETA PLATFORMS TECH LLC·Filed 2022·Granted May 27, 2025·0 cites·19 claims
- 3156US2014047711A1Method for mounting protective covers over image capture devices and devices manufactured therebyFLEXTRONICS AP LLC·Filed 2013·Application pending·0 cites
- 3255US2023280637A1Camera device with two-stage actuators and camera device packaging using sandwich molding techniqueMETA PLATFORMS TECH LLC·Filed 2023·Application pending·0 cites
- 3352US9748460B2LED back end assembly and method of manufacturingFLEXTRONICS AP LLC·Filed 2014·Granted Aug 29, 2017·0 cites·12 claims
- 3452US2007236591A1Method for mounting protective covers over image capture devices and devices manufactured therebyTAM SAMUEL W·Filed 2006·Application pending·0 cites
- 3551US2006255474A1Packaging structure and methodCHIPPAC INC·Filed 2006·Application pending·0 cites
- 3650US9312150B2Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip packageAHMAD NAZIR·Filed 2011·Granted Apr 12, 2016·0 cites·15 claims
- 3749US2012217635A9Packaging Structure and MethodAHMAD NAZIR·Filed 2011·Application pending·0 cites
- 3845US9041019B2Method of and device for manufacturing LED assembly using liquid molding technologiesFLEXTRONICS AP LLC·Filed 2012·Granted May 26, 2015·0 cites·15 claims
- 3944US2008170141A1Folded package camera module and method of manufactureTAM SAMUEL WAISING·Filed 2007·Application pending·0 cites
- 4044US2011299848A1Camera Module with Premolded Lens Housing and Method of ManufactureSHANGGUAN DONGKAI·Filed 2011·Application pending·0 cites
- 4142US8913180B2Folded tape package for electronic devicesTAM SAMUEL·Filed 2011·Granted Dec 16, 2014·0 cites·9 claims
- 4242US2005056944A1Super-thin high speed flip chip packageCHIPPAC INC·Filed 2004·Application pending·0 cites
- 4341US2004222440A1Chip scale package with flip chip interconnectCHIPPAC INC·Filed 2004·Application pending·0 cites
- 4440US2022385796A1Wearable device applicationsMETA PLATFORMS TECH LLC·Filed 2022·Application pending·0 cites
- 4540US2013026212A1Solder deposition system and method for metal bumpsFLEXTRONICS AP LLC·Filed 2012·Application pending·0 cites
- 4639US2002121707A1Super-thin high speed flip chip packageCHIPPAC INC·Filed 2002·Application pending·0 cites
- 4739US2002014702A1Packaging structure and methodFiled 2001·Application pending·0 cites
- 4838US2013128106A1Camera module housing having molded tape substrate with folded leadsTAM SAMUEL·Filed 2011·Application pending·0 cites
- 4937US9178093B2Solar cell module on molded lead-frame and method of manufactureTAM SAMUEL WAISING·Filed 2012·Granted Nov 3, 2015·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →