Inventor · disambiguated record
Masanobu Fujii
Also filed as: FUJII MASANOBU
10 granted patents·3 pending applications·290 citations·filing 1986–2018
91Inventor score
Top patents by PatentIndex Score
13 records- 0192US7544727B2Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphateHITACHI CHEMICAL CO LTD·Filed 2005·Granted Jun 9, 2009·31 cites·26 claims
- 0292US5611589ASeat arrangement for motor vehicleIKEDA BUSSAN CO·Filed 1994·Granted Mar 18, 1997·112 cites·9 claims
- 0376US4803324AMicrowave heating and infrared ray heating applianceSHARP KK·Filed 1987·Granted Feb 7, 1989·27 cites·4 claims
- 0473US4986865AMethod of producing trim boardIKEDA BUSSAN CO·Filed 1989·Granted Jan 22, 1991·32 cites·6 claims
- 0567US6768052B2Flexible printed circuit with EMI protectionMITSUMI ELECTRIC CO LTD·Filed 2002·Granted Jul 27, 2004·15 cites·5 claims
- 0665US4870255AInfrared ray heating appliance utilizing a convection fanSHARP KK·Filed 1988·Granted Sep 26, 1989·17 cites·8 claims
- 0764US4717811ADifferential resistance humidity detectorSHARP KK·Filed 1986·Granted Jan 5, 1988·23 cites·6 claims
- 0847US6194491B1Biphenyl epoxy resin, naphthalene-containing phenolic resin and accelerator triphenylphosphine/p-benzoquinoneHITACHI CHEMICAL CO LTD·Filed 1998·Granted Feb 27, 2001·14 cites·9 claims
- 0945US4768378AHumidity detecting circuitSHARP KK·Filed 1987·Granted Sep 6, 1988·12 cites·7 claims
- 1041US2020225340A1Radar device and target detection methodFUJII MASANOBU·Filed 2018·Application pending·0 cites
- 1136US2003201548A1Epoxy resin molding material for sealingFiled 2001·Application pending·0 cites
- 1236US2012163438A1Signal processing device and signal processing methodFUJII MASANOBU·Filed 2010·Application pending·0 cites
- 1333US6211277B1Encapsulating material and LOC structure semiconductor device using the sameHITACHI CHEMICAL CO LTD·Filed 1998·Granted Apr 3, 2001·7 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →