Inventor · disambiguated record
Sohyun Park
Also filed as: CUI ZHENJIANG · PARK SOHYUN · PARK SOHYUN S · PARK SOHYUN SARA
49 granted patents·23 pending applications·674 citations·filing 2004–2025
97Inventor score
Files withSAMSUNG ELECTRONICS CO LTD31KIMBERLY CLARK CO10APPLIED MATERIALS INC9VERILY LIFE SCIENCES LLC6MEDLINE IND INC4
Top patents by PatentIndex Score
72 records- 0197US11665883B2Semiconductor memory device having spacer capping pattern disposed between burried dielectic pattern and an air gap and method of fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 30, 2023·10 cites·20 claims
- 0296US8076250B1PECVD oxide-nitride and oxide-silicon stacks for 3D memory applicationRAJAGOPALAN NAGARAJAN·Filed 2010·Granted Dec 13, 2011·488 cites·20 claims
- 0395US11404538B2Semiconductor memory device and method of fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 2, 2022·5 cites·19 claims
- 0493US11282787B2Semiconductor devices having improved electrical characteristics and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 22, 2022·3 cites·18 claims
- 0592US9810910B1Contact lens with phase map displayVERILY LIFE SCIENCES LLC·Filed 2015·Granted Nov 7, 2017·13 cites·20 claims
- 0692US7030041B2Adhesion improvement for low k dielectricsAPPLIED MATERIALS INC·Filed 2004·Granted Apr 18, 2006·45 cites·20 claims
- 0791US9798147B1Near-eye display with phase mapVERILY LIFE SCIENCES LLC·Filed 2015·Granted Oct 24, 2017·11 cites·26 claims
- 0889US11364109B2Intraocular device with wirelessly coupled auxiliary electronicsVERILY LIFE SCIENCES LLC·Filed 2020·Granted Jun 21, 2022·2 cites·12 claims
- 0989US9761591B2Method of forming semiconductor device including edge chip and related deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 12, 2017·5 cites·20 claims
- 1089US7867578B2Method for depositing an amorphous carbon film with improved density and step coverageAPPLIED MATERIALS INC·Filed 2006·Granted Jan 11, 2011·12 cites·14 claims
- 1188US9935111B2Method of forming semiconductor device including edge chip and related deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 3, 2018·4 cites·9 claims
- 1288US8227352B2Amorphous carbon deposition method for improved stack defectivityYU HANG·Filed 2011·Granted Jul 24, 2012·13 cites·20 claims
- 1386US10076408B2Intraocular device with wirelessly coupled auxiliary electronicsVERILY LIFE SCIENCES LLC·Filed 2016·Granted Sep 18, 2018·7 cites·7 claims
- 1485US11037930B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 15, 2021·4 cites·20 claims
- 1584US7166544B2Method to deposit functionally graded dielectric films via chemical vapor deposition using viscous precursorsAPPLIED MATERIALS INC·Filed 2004·Granted Jan 23, 2007·20 cites·22 claims
- 1683US2025351333A1Semiconductor device and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1781US11600570B2Semiconductor memory device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 7, 2023·1 cites·20 claims
- 1878US10512566B2Absorbent article with flat-back protection featureKIMBERLY CLARK CO·Filed 2017·Granted Dec 24, 2019·5 cites·24 claims
- 1977US10820987B2Intraocular device with wirelessly coupled auxiliary electronicsVERILY LIFE SCIENCES LLC·Filed 2018·Granted Nov 3, 2020·2 cites·10 claims
- 2075US12239513B2Absorbent article with body conforming structureKIMBERLY CLARK CO·Filed 2022·Granted Mar 4, 2025·0 cites·11 claims
- 2175US11929324B2Semiconductor devices having improved electrical characteristics and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 12, 2024·0 cites·20 claims
- 2273US10376424B2Absorbent article with flat-back protection featureKIMBERLY CLARK CO·Filed 2017·Granted Aug 13, 2019·3 cites·15 claims
- 2372US12396159B2Semiconductor device and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 19, 2025·0 cites·20 claims
- 2472US7459404B2Adhesion improvement for low k dielectricsAPPLIED MATERIALS INC·Filed 2006·Granted Dec 2, 2008·2 cites·16 claims
- 2572US2025365937A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2671US11658117B2Semiconductor devices having improved electrical characteristics and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 23, 2023·0 cites·20 claims
- 2770US12453085B2Semiconductor memory device having connection pattern between the bit line contact and the separation insulating patternSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 21, 2025·0 cites·20 claims
- 2869US2025227916A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2968US12289881B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 29, 2025·0 cites·10 claims
- 3065US12453082B2Semiconductor device having a cell separation pattern in contact with the bit line contactSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 21, 2025·0 cites·20 claims
- 3165US11478384B2Absorbent article with body conforming structureKIMBERLY CLARK CO·Filed 2020·Granted Oct 25, 2022·0 cites·11 claims
- 3264US12414289B1Semiconductor devices having air spacerSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·12 claims
- 3364US10092177B1Device, system and method for image display with a programmable phase mapVERILY LIFE SCIENCES LLC·Filed 2015·Granted Oct 9, 2018·1 cites·22 claims
- 3464US2025071967A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3563US12283974B2System and method for distribution storage of blockchain transaction data based on erasure codeELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Granted Apr 22, 2025·0 cites·18 claims
- 3663US10695232B2Absorbent article with body conforming structureKIMBERLY CLARK CO·Filed 2014·Granted Jun 30, 2020·1 cites·9 claims
- 3762US7802538B2Method to deposit functionally graded dielectric films via chemical vapor deposition using viscous precursorsAPPLIED MATERIALS INC·Filed 2006·Granted Sep 28, 2010·0 cites·13 claims
- 3862US2025031363A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3962US2024349483A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4062US2024144321A1Method, system, and recording medium for expanding and utilizing data using pseudonymous associationNAVER CORP·Filed 2023·Application pending·0 cites
- 4161US12353335B2Semiconductor device and method of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·19 claims
- 4260US11114619B2Conjugated polymer for a photoactive layer, a coating composition including the conjugated polymer, and an organic solar cell including the photoactive layerKOREA INST SCI & TECH·Filed 2019·Granted Sep 7, 2021·0 cites·10 claims
- 4360US2024431097A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4459US2024414909A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4556US11482655B2Thermoelectric measurement system and thermoelectric device based on liquid eutectic gallium-indium electrodeUNIV KOREA RES & BUS FOUND·Filed 2019·Granted Oct 25, 2022·0 cites·10 claims
- 4656US2023189503A1Semiconductor memory devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4756US2024324183A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4856US2025119304A1Authority authentication system for electronic device and method of operating sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4956US2025071969A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 5054US12166903B2Computing device in a trusted computing system and attestation method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 10, 2024·0 cites·20 claims
Showing the top 50 of 72 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →