Inventor · disambiguated record
Kyle Whitten
Also filed as: WHITTEN KYLE · WHITTEN KYLE M
15 granted patents·6 pending applications·6 citations·filing 2014–2025
86Inventor score
Top patents by PatentIndex Score
21 records- 0184US11384446B2Compositions and methods for the electrodeposition of nanotwinned copperMACDERMID ENTHONE INC·Filed 2020·Granted Jul 12, 2022·1 cites·12 claims
- 0282US2024110306A1Compositions and Methods for the Electrodeposition of Nanotwinned CopperMACDERMID ENTHONE INC·Filed 2023·Application pending·0 cites
- 0380US11873568B2Compositions and methods for the electrodeposition of nanotwinned copperMACDERMID ENTHONE INC·Filed 2022·Granted Jan 16, 2024·0 cites·15 claims
- 0480US11035048B2Cobalt filling of interconnectsMACDERMID ENTHONE INC·Filed 2017·Granted Jun 15, 2021·3 cites·30 claims
- 0577US11697884B2Copper deposition in wafer level packaging of integrated circuitsMACDERMID ENTHONE INC·Filed 2021·Granted Jul 11, 2023·0 cites·15 claims
- 0676US10519557B2Leveler compositions for use in copper deposition in manufacture of microelectronicsMACDERMID ENTHONE INC·Filed 2017·Granted Dec 31, 2019·2 cites·28 claims
- 0770US11434578B2Cobalt filling of interconnects in microelectronicsMACDERMID ENTHONE INC·Filed 2021·Granted Sep 6, 2022·0 cites·28 claims
- 0869US12398480B2Leveler compositions for use in copper deposition in manufacture of microelectronicsMACDERMID ENTHONE INC·Filed 2021·Granted Aug 26, 2025·0 cites·15 claims
- 0969US2024018678A1Copper Electrodeposition in MicroelectronicsMACDERMID ENTHONE INC·Filed 2023·Application pending·0 cites
- 1068US2025243596A1Composition and Method for Fabrication of Nickel InterconnectsMACDERMID ENTHONE INC·Filed 2025·Application pending·0 cites
- 1166US11401618B2Cobalt filling of interconnectsMACDERMID ENTHONE INC·Filed 2021·Granted Aug 2, 2022·0 cites·31 claims
- 1263US10995417B2Cobalt filling of interconnects in microelectronicsMACDERMID ENTHONE INC·Filed 2016·Granted May 4, 2021·0 cites·20 claims
- 1360US11807951B2Cobalt chemistry for smooth topologyMACDERMID ENTHONE INC·Filed 2021·Granted Nov 7, 2023·0 cites·16 claims
- 1459US11168406B2Leveler compositions for use in copper deposition in manufacture of microelectronicsMACDERMID ENTHONE INC·Filed 2019·Granted Nov 9, 2021·0 cites·31 claims
- 1557US12270121B2Composition and method for fabrication of nickel interconnectsMACDERMID ENTHONE INC·Filed 2020·Granted Apr 8, 2025·0 cites·19 claims
- 1655US11230778B2Cobalt chemistry for smooth topologyMACDERMID ENTHONE INC·Filed 2019·Granted Jan 25, 2022·0 cites·21 claims
- 1750US11124888B2Copper deposition in wafer level packaging of integrated circuitsMACDERMID ENTHONE INC·Filed 2017·Granted Sep 21, 2021·0 cites·17 claims
- 1849US2024318342A1Compositions and methods for the eletrodeposition of nanotwinned copperMACDERMID ENTHONE INC·Filed 2022·Application pending·0 cites
- 1948US2019390356A1Copper Electrodeposition in MicroelectronicsMACDERMID ENTHONE INC·Filed 2017·Application pending·0 cites
- 2043US2016281251A1Electrodeposition of CopperENTHONE·Filed 2014·Application pending·0 cites
- 2139US10294574B2Levelers for copper deposition in microelectronicsMACDERMID ENTHONE INC·Filed 2015·Granted May 21, 2019·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →