Inventor · disambiguated record
Yoshikuni Tateyama
Also filed as: TATEYAMA YOSHIKUNI
22 granted patents·15 pending applications·331 citations·filing 1996–2019
95Inventor score
Top patents by PatentIndex Score
37 records- 0193US6036582APolishing apparatusEBARA CORP·Filed 1998·Granted Mar 14, 2000·61 cites·20 claims
- 0288US6561876B1CMP method and semiconductor manufacturing apparatusTOSHIBA KK·Filed 2000·Granted May 13, 2003·43 cites·21 claims
- 0387US7042099B2Semiconductor device containing a dummy wireTOSHIBA KK·Filed 2003·Granted May 9, 2006·35 cites·22 claims
- 0487US5664989APolishing pad, polishing apparatus and polishing methodTOSHIBA KK·Filed 1996·Granted Sep 9, 1997·74 cites·30 claims
- 0584US6338744B1Polishing slurry and polishing methodTOKUYAMA CORP·Filed 2000·Granted Jan 15, 2002·29 cites·9 claims
- 0680US7883394B2Substrate holding mechanism, substrate polishing apparatus and substrate polishing methodEBARA CORP·Filed 2008·Granted Feb 8, 2011·5 cites·10 claims
- 0775US8292694B2Substrate holding mechanism, substrate polishing apparatus and substrate polishing methodTOGAWA TETSUJI·Filed 2009·Granted Oct 23, 2012·4 cites·13 claims
- 0874US6835116B2Polishing apparatusEBARA CORP·Filed 2001·Granted Dec 28, 2004·17 cites·12 claims
- 0972US7521350B2Manufacturing method of a semiconductor deviceTOSHIBA KK·Filed 2006·Granted Apr 21, 2009·4 cites·18 claims
- 1072US6858936B2Semiconductor device having an improved construction in the interlayer insulating filmTOSHIBA KK·Filed 2003·Granted Feb 22, 2005·15 cites·10 claims
- 1166US8685857B2Chemical mechanical polishing method of organic film and method of manufacturing semiconductor deviceMATSUI YUKITERU·Filed 2008·Granted Apr 1, 2014·2 cites·8 claims
- 1259US7419420B2Substrate holding mechanism, substrate polishing apparatus and substrate polishing methodEBARA CORP·Filed 2003·Granted Sep 2, 2008·5 cites·8 claims
- 1359US6645053B1Polishing apparatusEBARA CORP·Filed 1999·Granted Nov 11, 2003·17 cites·11 claims
- 1458US7144804B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2004·Granted Dec 5, 2006·6 cites·10 claims
- 1557US7101801B2Method of manufacturing semiconductor device using chemical mechanical polishingTOSHIBA KK·Filed 2003·Granted Sep 5, 2006·5 cites·20 claims
- 1657US6984582B2Method of making semiconductor device by polishing with intermediate clean polishingTOSHIBA KK·Filed 2003·Granted Jan 10, 2006·5 cites·20 claims
- 1755US7951717B2Post-CMP treating liquid and manufacturing method of semiconductor device using the sameTOSHIBA KK·Filed 2007·Granted May 31, 2011·0 cites·9 claims
- 1853US8078306B2Polishing apparatus and polishing methodNAKAO HIDETAKA·Filed 2008·Granted Dec 13, 2011·1 cites·9 claims
- 1953US7452819B2Chemical mechanical polishing method of organic film and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2004·Granted Nov 18, 2008·3 cites·15 claims
- 2051US7888139B2Fabricating method of nonvolatile semiconductor storage apparatusTOSHIBA KK·Filed 2009·Granted Feb 15, 2011·0 cites·14 claims
- 2149US2009124172A1Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical polishingJSR CORP·Filed 2007·Application pending·0 cites
- 2248US8174125B2Manufacturing method of a semiconductor deviceKURASHIMA NOBUYUKI·Filed 2009·Granted May 8, 2012·0 cites·22 claims
- 2347US7985685B2Method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2008·Granted Jul 26, 2011·0 cites·20 claims
- 2446US2009156000A1Method of manufacturing semiconductor deviceMATSUI YUKITERU·Filed 2008·Application pending·0 cites
- 2546US2011250756A1Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical polishingTOSHIBA KK·Filed 2011·Application pending·0 cites
- 2646US2009176372A1Chemical mechanical polishing slurry and semiconductor device manufacturing methodMINAMIHABA GAKU·Filed 2008·Application pending·0 cites
- 2744US2009068840A1Polishing liquid and method for manufacturing semiconductor deviceMINAMIHABA GAKU·Filed 2008·Application pending·0 cites
- 2843US2007049180A1Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing process, and process for producing semiconductor devicesTOSHIBA KK·Filed 2006·Application pending·0 cites
- 2943US2009258493A1Semiconductor device manufacturing methodMATSUI YUKITERU·Filed 2009·Application pending·0 cites
- 3043US2008045016A1Cleaning composition, cleaning method, and manufacturing method of semiconductor deviceJSR CORP·Filed 2007·Application pending·0 cites
- 3141US2011195888A1Post-cmp treating liquid and manufacturing method of semiconductor device using the sameKURASHIMA NOBUYUKI·Filed 2011·Application pending·0 cites
- 3241US2002158395A1Chemical mechanical polishing method and semiconductor device manufacturing methodFiled 2002·Application pending·0 cites
- 3341US2004072512A1Polishing apparatusFiled 2003·Application pending·0 cites
- 3440US2020118859A1Apparatus for processing substrateTOSHIBA KK·Filed 2019·Application pending·0 cites
- 3539US2004002292A1Polishing apparatus, polishing method and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2003·Application pending·0 cites
- 3637US2010193850A1Semiconductor memory deviceTOSHIBA KK·Filed 2010·Application pending·0 cites
- 3737US2005227489A1Polishing pad and method of manufacturing semiconductor devicesMINAMIHARA GAKU·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →