Inventor · disambiguated record
Suk Jin Ham
Also filed as: HAM SUK JIN
22 granted patents·44 pending applications·129 citations·filing 2006–2015
93Inventor score
Files withSAMSUNG ELECTRO MECH37SAMSUNG ELECTRONICS CO LTD7LEE KWANG JIK6KIM JAE-IL2MYOUNG SEON YOUNG2
Top patents by PatentIndex Score
66 records- 0197US7285865B2Micro-package, multi-stack micro-package, and manufacturing method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Oct 23, 2007·57 cites·23 claims
- 0290US7374972B2Micro-package, multi-stack micro-package, and manufacturing method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 20, 2008·18 cites·15 claims
- 0386US7755151B2Wafer level package for surface acoustic wave device and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jul 13, 2010·15 cites·11 claims
- 0485US8940186B2Insulating layer composition for substrate, and prepreg and substrate using the sameSAMSUNG ELECTRO MECH·Filed 2012·Granted Jan 27, 2015·3 cites·17 claims
- 0584US7449366B2Wafer level packaging cap and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 11, 2008·12 cites·18 claims
- 0683US7408257B2Packaging chip and packaging method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 5, 2008·11 cites·13 claims
- 0782US9263187B2Multilayer ceramic electronic component and method of manufacturing the sameLEE KWANG JIK·Filed 2012·Granted Feb 16, 2016·5 cites·11 claims
- 0882US9045646B2Insulating composition for substrate, and prepreg and substrate using the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Jun 2, 2015·3 cites·17 claims
- 0968US7906841B2Wafer level incapsulation chip and encapsulation chip manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 15, 2011·4 cites·5 claims
- 1063US9189105B2Touch sensorSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 17, 2015·1 cites·18 claims
- 1156US2011062391A1Manufacturing method of compound semiconductor material, and compound semiconductor material using the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1255US8755167B2Ceramic sheet product for ceramic electronic component, multilayer ceramic electronic component using the same and method of manufacturing multilayer ceramic electronic componentLEE KWANG JIK·Filed 2011·Granted Jun 17, 2014·0 cites·5 claims
- 1353US9095063B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Jul 28, 2015·0 cites·12 claims
- 1450US9030432B2Touch panel and producing method for via electrodeSAMSUNG ELECTRO MECH·Filed 2013·Granted May 12, 2015·0 cites·11 claims
- 1550US2015162134A1Multilayer thin film for ceramic electronic component and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 1650US2015163924A1Method of bonding electronic components and electronic device using the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1749US2014187687A1Insulation materials, insulation composition comprising the same, and substrate using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1849US2014352413A1Moisture transmission testing instrumentSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1948US9279861B2Apparatus for testing switching of power semiconductor moduleSAMSUNG ELECTRO MECH·Filed 2013·Granted Mar 8, 2016·0 cites·19 claims
- 2048US9164145B2Apparatus and method for testing semiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 20, 2015·0 cites·15 claims
- 2148US8974901B2Multilayer thin film for ceramic electronic component and method of manufacturing the sameLEE KWANG JIK·Filed 2011·Granted Mar 10, 2015·0 cites·6 claims
- 2248US8013349B2Light emitting device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 6, 2011·0 cites·9 claims
- 2348US2014139835A1Measurement device of degree of cureSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2447US9470635B2System of measuring warpage and method of measuring warpageSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 18, 2016·0 cites·11 claims
- 2547US9065071B2Organic light emitting device with a protective layer including at least one of a nano-clay and a graphite oxide formed on the anodeLEE KWANG JIK·Filed 2011·Granted Jun 23, 2015·0 cites·10 claims
- 2647US2014170412A1Insulating composition, substrate including insulating layer using the same, and method for manufacturing the substrateSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2747US2014041206A1Method for repairing via of circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2846US9155192B2Electronic component packageSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 6, 2015·0 cites·10 claims
- 2946US9099329B2In nanowire, device using the same and method of manufacturing in nanowireSAMSUNG ELECTRO MECH·Filed 2013·Granted Aug 4, 2015·0 cites·20 claims
- 3046US2014138138A1Printed circuit board having electronic component embedded thereinSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3146US2014131083A1Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3245US9192050B2Method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 17, 2015·0 cites·17 claims
- 3345US2013115369A1Apparatus for forming circuit pattern on pcb and method for forming circuit pattern using the sameSEO SHANG HOON·Filed 2012·Application pending·0 cites
- 3445US2013251887A1Nano-patterning apparatus, system having the same, and control method thereofMYOUNG SEON YOUNG·Filed 2012·Application pending·0 cites
- 3545US2014176828A1Touch panelSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3643US2013334290A1Solder paste droplet ejection apparatus, patterning system having the same, and control method thereofLEE YOUNG JU·Filed 2012·Application pending·0 cites
- 3743US2015114131A1Bonding force test deviceSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3843US2013107110A1Camera moduleSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 3943US2014147926A1Method of analyzing aldehyde compound in metal plating solutionSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4043US2014106278A1Dry film resist sheet and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 4143US2014140373A1Apparatus and method of testing semiconductor moduleC O SAMSUNG ELECTRO MECHANICS CO LTD·Filed 2013·Application pending·0 cites
- 4242US2014152980A1Inspection device for substrate deformation at high temperatures and inspection method for substrate deformation at high temperatures using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4342US2014184782A1System of measuring warpage and method of measuring warpageSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4442US2014185244A1Thermally conductive film and circuit board moduleSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4542US2014158507A1Touch panelSUMSUNG ELECTRO MECHANICS CO LTD·Filed 2013·Application pending·0 cites
- 4641US2013068039A1Specimen conveyance apparatusMYOUNG SEON YOUNG·Filed 2011·Application pending·0 cites
- 4741US2013048943A1Organic light emitting diode and fabrication method thereofLEE KWANG JIK·Filed 2012·Application pending·0 cites
- 4841US2014178814A1Dry film photoresist having oxygen permeable barrier layer and manufacturing method thereofLTD SAMSUNG ELECTRO MECHANICS CO·Filed 2013·Application pending·0 cites
- 4941US2014145322A1Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 5041US2013038982A1Multilayer ceramic condenser and method for manufacturing the sameLEE KWANG JIK·Filed 2012·Application pending·0 cites
Showing the top 50 of 66 patent records by PatentIndex Score.
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