Inventor · disambiguated record
Mohammad Eslamy
Also filed as: ESLAMY MOHAMMAD
14 granted patents·3 pending applications·300 citations·filing 1997–2011
93Inventor score
Top patents by PatentIndex Score
17 records- 0197US6640415B2Segmented contactorFORMFACTOR INC·Filed 2002·Granted Nov 4, 2003·166 cites·40 claims
- 0287US7838339B2Semiconductor device package having features formed by stampingGEM SERVICES INC·Filed 2008·Granted Nov 23, 2010·14 cites·19 claims
- 0384US6596618B1Increased solder-bump height for improved flip-chip bonding and reliabilityALTERA CORP·Filed 2001·Granted Jul 22, 2003·33 cites·19 claims
- 0478US7578057B2Method of fabricating segmented contactorFORMFACTOR INC·Filed 2006·Granted Aug 25, 2009·6 cites·14 claims
- 0578US6485843B1Apparatus and method for mounting BGA devicesALTERA CORP·Filed 2001·Granted Nov 26, 2002·27 cites·25 claims
- 0673US7691670B2Interconnection of lead frame to die utilizing flip chip processGEM SERVICES INC·Filed 2008·Granted Apr 6, 2010·5 cites·19 claims
- 0770US6784536B1Symmetric stack up structure for organic BGA chip carriersALTERA CORP·Filed 2001·Granted Aug 31, 2004·17 cites·8 claims
- 0868US8106493B2Semiconductor device package having features formed by stampingTSUI ANTHONY C·Filed 2010·Granted Jan 31, 2012·3 cites·20 claims
- 0966US8011089B2Method of repairing segmented contactorFORMFACTOR INC·Filed 2009·Granted Sep 6, 2011·2 cites·8 claims
- 1062US7065870B2Segmented contactorFORMFACTOR INC·Filed 2003·Granted Jun 27, 2006·5 cites·16 claims
- 1150US2011171838A1Segmented contactorFORMFACTOR INC·Filed 2011·Application pending·0 cites
- 1246US6130113AEnhanced lamination process between heatspreader to pressure sensitive adhesive (PSA) interface as a step in the semiconductor assembly processLSI LOGIC CORP·Filed 1998·Granted Oct 10, 2000·14 cites·9 claims
- 1344US7215131B1Segmented contactorFORMFACTOR INC·Filed 1999·Granted May 8, 2007·6 cites·24 claims
- 1441US8120154B2Interconnection of lead frame to die utilizing flip chip processESLAMY MOHAMMAD·Filed 2010·Granted Feb 21, 2012·0 cites·10 claims
- 1540US2006163462A1Localized hermetic sealing of a power monitor on a planar light circuitESLAMY MOHAMMAD·Filed 2006·Application pending·0 cites
- 1638US2004183003A1Localized hermetic sealing of a power monitor on a planar light circuitFiled 2003·Application pending·0 cites
- 1730US5973398ASemiconductor device and fabrication method employing a palladium-plated heat spreader substrateLSI LOGIC CORP·Filed 1997·Granted Oct 26, 1999·2 cites·22 claims
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