Inventor · disambiguated record
Fumitoshi Ikegaya
Also filed as: IKEGAYA FUMITOSHI
9 granted patents·2 pending applications·318 citations·filing 1994–2017
89Inventor score
Top patents by PatentIndex Score
11 records- 0196US5600103ACircuit devices and fabrication method of the sameTOSHIBA KK·Filed 1994·Granted Feb 4, 1997·129 cites·8 claims
- 0293US6010769AMultilayer wiring board and method for forming the sameTOSHIBA KK·Filed 1996·Granted Jan 4, 2000·119 cites·59 claims
- 0386US5822850ACircuit devices and fabrication Method of the sameTOSHIBA KK·Filed 1995·Granted Oct 20, 1998·51 cites·23 claims
- 0476US10483126B2Semiconductor manufacturing apparatus and manufacturing method of semiconductor deviceTOSHIBA MEMORY CORP·Filed 2017·Granted Nov 19, 2019·2 cites·1 claims
- 0570US7134193B2Method for manufacturing a wiring boardDAINIPPON PRINTING CO LTD·Filed 2004·Granted Nov 14, 2006·10 cites·1 claims
- 0663US7526859B2Apparatus for manufacturing a wiring boardDAINIPPON PRINTING CO LTD·Filed 2006·Granted May 5, 2009·0 cites·2 claims
- 0754US2015068911A1Copper plating apparatus, copper plating method and method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2013·Application pending·0 cites
- 0853US6865801B2Apparatus for manufacturing a wiring boardTOSHIBA KK·Filed 2001·Granted Mar 15, 2005·3 cites·16 claims
- 0943US10738389B2Semiconductor manufacturing apparatusTOSHIBA MEMORY CORP·Filed 2015·Granted Aug 11, 2020·0 cites·2 claims
- 1038US2005272258A1Method of manufacturing a semiconductor device and semiconductor deviceMORITA TOSHIYUKI·Filed 2005·Application pending·0 cites
- 1135US6507995B1Apparatus for manufacturing a wiring substrateTOSHIBA KK·Filed 1998·Granted Jan 21, 2003·4 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →