Inventor · disambiguated record
Younggwan Ko
Also filed as: KO YOUNGGWAN
8 granted patents·3 pending applications·10 citations·filing 2019–2024
79Inventor score
Files withSAMSUNG ELECTRONICS CO LTD11
Top patents by PatentIndex Score
11 records- 0183US11088115B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 10, 2021·4 cites·19 claims
- 0276US11329014B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 10, 2022·2 cites·16 claims
- 0376US11121079B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 14, 2021·2 cites·20 claims
- 0476US2025140755A1Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0574US11049782B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 29, 2021·2 cites·15 claims
- 0664US12218099B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 4, 2025·0 cites·16 claims
- 0764US11935847B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 19, 2024·0 cites·18 claims
- 0864US11842950B2Package moduleSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 12, 2023·0 cites·20 claims
- 0963US11837537B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 5, 2023·0 cites·20 claims
- 1055US2020176364A1Package moduleSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 1140US2020152569A1Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →