Inventor · disambiguated record
Fu-Yu Huang
Also filed as: HUANG FU-YU
7 granted patents·9 pending applications·32 citations·filing 2000–2016
81Inventor score
Top patents by PatentIndex Score
16 records- 0159US6499648B2Method and device for making a metal bump with an increased heightORIENT SEMICONDUCTOR ELECT LTD·Filed 2001·Granted Dec 31, 2002·9 cites·1 claims
- 0252US6390356B1Method of forming cylindrical bumps on a substrate for integrated circuitsORIENT SEMICONDUCTOR ELECT LTD·Filed 2000·Granted May 21, 2002·5 cites·1 claims
- 0351US6567270B2Semiconductor chip package with cooling arrangementORIENT SEMICONDUCTOR ELECT LTD·Filed 2001·Granted May 20, 2003·6 cites·1 claims
- 0451US6358834B1Method of forming bumps on wafers or substratesORIENT SEMICONDUCTOR ELECT LTD·Filed 2000·Granted Mar 19, 2002·6 cites·2 claims
- 0549US6274491B1Process of manufacturing thin ball grid array substratesORIENT SEMICONDUCTOR ELECT LTD·Filed 2000·Granted Aug 14, 2001·6 cites·1 claims
- 0642US9661442B2Method and apparatus for transmitting digital contentsHUANG FU-YU·Filed 2012·Granted May 23, 2017·0 cites·28 claims
- 0737US2003164303A1Method of metal electro-plating for IC package substrateFiled 2002·Application pending·0 cites
- 0835US10212567B2User device, base device and system utilizing audio signal to transmit data, and method thereofEASON TECH CO LTD·Filed 2012·Granted Feb 19, 2019·0 cites·28 claims
- 0934US2003059721A1Fabrication method of semiconductorFiled 2002·Application pending·0 cites
- 1034US2003006268A1Method and device for making a metal bump with an increased heightFiled 2001·Application pending·0 cites
- 1132US2004183179A1Package structure for a multi-chip integrated circuitFiled 2003·Application pending·0 cites
- 1232US2003160316A1Open-type multichips stack packagingFiled 2003·Application pending·0 cites
- 1331US2004082174A1Method of wire bonding of a semiconductor device for resolving oxidation of copper bonding padFiled 2003·Application pending·0 cites
- 1431US2002072216A1Manufacturing method for multilayer high density substrateFiled 2001·Application pending·0 cites
- 1530US2004082159A1Fabrication method for solder bump pattern of rear section wafer packageFiled 2003·Application pending·0 cites
- 1624US2016309403A1Control System for Air Wave Detecting and Control Method ThereofMERCUE INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →