Inventor · disambiguated record
Hizuru Yamaguchi
Also filed as: YAMAGUCHI HIZURU
38 granted patents·3 pending applications·988 citations·filing 1990–2019
98Inventor score
Files withHITACHI LTD14RENESAS ELECTRONICS CORP12RENESAS TECH CORP10FUNAKOSHI TAKAKO1KAMATA TADASHI1
Top patents by PatentIndex Score
41 records- 0198US6184143B1Semiconductor integrated circuit device and fabrication process thereofHITACHI LTD·Filed 1998·Granted Feb 6, 2001·342 cites·25 claims
- 0296US6731007B1Semiconductor integrated circuit device with vertically stacked conductor interconnectionsHITACHI LTD·Filed 2000·Granted May 4, 2004·85 cites·50 claims
- 0393US9064870B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2014·Granted Jun 23, 2015·7 cites·15 claims
- 0491US7659201B2Process for manufacturing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2008·Granted Feb 9, 2010·10 cites·26 claims
- 0591US7411301B2Semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2005·Granted Aug 12, 2008·16 cites·20 claims
- 0690US7323781B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2004·Granted Jan 29, 2008·30 cites·24 claims
- 0790US6326299B1Method for manufacturing a semiconductor deviceHITACHI LTD·Filed 1999·Granted Dec 4, 2001·88 cites·45 claims
- 0889US9659867B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2016·Granted May 23, 2017·2 cites·4 claims
- 0988US8617981B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2013·Granted Dec 31, 2013·4 cites·12 claims
- 1088US7387957B2Fabrication process for a semiconductor integrated circuit deviceHITACHI LTD·Filed 2005·Granted Jun 17, 2008·12 cites·3 claims
- 1187US8431480B2Semiconductor device and manufacturing method thereofNOGUCHI JUNJI·Filed 2011·Granted Apr 30, 2013·4 cites·12 claims
- 1286US8384220B2Semiconductor integrated circuit device and fabrication process thereofHITACHI LTD·Filed 2008·Granted Feb 26, 2013·10 cites·6 claims
- 1385US6376345B1Process for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 1999·Granted Apr 23, 2002·46 cites·107 claims
- 1484US8053893B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2009·Granted Nov 8, 2011·6 cites·14 claims
- 1584US7510970B2Process for manufacturing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2006·Granted Mar 31, 2009·5 cites·8 claims
- 1684US5244820ASemiconductor integrated circuit device, method for producing the same, and ion implanter for use in the methodKAMATA TADASHI·Filed 1992·Granted Sep 14, 1993·113 cites·37 claims
- 1783US6730590B2Semiconductor integrated circuit device and fabrication process thereofRENESAS TECH CORP·Filed 2002·Granted May 4, 2004·23 cites·32 claims
- 1882US6458674B1Process for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 2002·Granted Oct 1, 2002·16 cites·101 claims
- 1982US6403459B1Fabrication process of semiconductor integrated circuit deviceHITACHI LTD·Filed 2000·Granted Jun 11, 2002·22 cites·36 claims
- 2081US6716749B2Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Apr 6, 2004·14 cites·6 claims
- 2181US6638854B2Semiconductor device and method for manufacturing the sameHITACHI LTD·Filed 2002·Granted Oct 28, 2003·25 cites·16 claims
- 2280US6861756B2Semiconductor integrated circuit device and fabrication process thereofHITACHI LTD·Filed 2004·Granted Mar 1, 2005·20 cites·21 claims
- 2378US6531400B2Process for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 2002·Granted Mar 11, 2003·12 cites·30 claims
- 2477US8810034B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2013·Granted Aug 19, 2014·1 cites·9 claims
- 2575US10304726B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2018·Granted May 28, 2019·0 cites·11 claims
- 2675US2019244855A1Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2019·Application pending·0 cites
- 2774US6849535B2Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Feb 1, 2005·9 cites·3 claims
- 2873US7777343B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2006·Granted Aug 17, 2010·2 cites·6 claims
- 2973US7023091B2Semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2003·Granted Apr 4, 2006·13 cites·11 claims
- 3072US10121693B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 6, 2018·0 cites·11 claims
- 3171US7977238B2Method of manufacturing a semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Jul 12, 2011·2 cites·16 claims
- 3271US6800557B2Process for manufacturing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2003·Granted Oct 5, 2004·8 cites·5 claims
- 3370US9818639B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 14, 2017·0 cites·4 claims
- 3466US9490213B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 8, 2016·0 cites·8 claims
- 3566US7786585B2Semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2008·Granted Aug 31, 2010·2 cites·32 claims
- 3662US5073810ASemiconductor integrated circuit device and manufacturing method thereofHITACHI LTD·Filed 1990·Granted Dec 17, 1991·28 cites·7 claims
- 3749US8129275B2Process for manufacturing semiconductor integrated circuit deviceOHASHI NAOFUMI·Filed 2010·Granted Mar 6, 2012·0 cites·15 claims
- 3846US5234845AMethod of manufacturing semiconductor IC using selective poly and EPI silicon growthHITACHI LTD·Filed 1992·Granted Aug 10, 1993·11 cites·5 claims
- 3945US8093723B2Method of manufacturing a semiconductor integrated circuit deviceFUNAKOSHI TAKAKO·Filed 2011·Granted Jan 10, 2012·0 cites·8 claims
- 4045US2004152298A1Process for manufacturing semiconductor integrated circuit deviceFiled 2004·Application pending·0 cites
- 4140US2002025605A1Semiconductor device and method for manufacturing the sameHITACHI LTD·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →