Inventor · disambiguated record
Junmo Koo
Also filed as: KOO JUNMO
6 granted patents·18 citations·filing 2011–2021
77Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0187US9257411B2Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulationSTATS CHIPPAC LTD·Filed 2014·Granted Feb 9, 2016·7 cites·23 claims
- 0280US9865554B2Integrated circuit packaging system with under bump metallization and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2015·Granted Jan 9, 2018·3 cites·12 claims
- 0376US12388046B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 12, 2025·1 cites·15 claims
- 0471US8399306B2Integrated circuit packaging system with transparent encapsulation and method of manufacture thereofKOO JUNMO·Filed 2011·Granted Mar 19, 2013·5 cites·18 claims
- 0569US9202793B1Integrated circuit packaging system with under bump metallization and method of manufacture thereofSHIM IL KWON·Filed 2013·Granted Dec 1, 2015·2 cites·10 claims
- 0647US9059157B2Integrated circuit packaging system with substrate and method of manufacture thereofLIN YAOJIAN·Filed 2013·Granted Jun 16, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →