Inventor · disambiguated record
Lan-Lin Chao
Also filed as: CHAO LAN-LIN
83 granted patents·5 pending applications·2,134 citations·filing 1999–2023
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD50TAIWAN SEMICONDUCTOR MFG18LIU PING-YIN4HSIEH YUAN-CHIH3CHEN SZU-YING2
Top patents by PatentIndex Score
88 records- 0199US9355882B2Transfer module for bowed wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 31, 2016·391 cites·20 claims
- 0299US9257399B23D integrated circuit and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 9, 2016·232 cites·19 claims
- 0399US8802538B1Methods for hybrid wafer bondingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 12, 2014·269 cites·20 claims
- 0498US10103122B2Hybrid bonding systems and methods for semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 16, 2018·26 cites·20 claims
- 0598US9443796B2Air trench in packages incorporating hybrid bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 13, 2016·221 cites·20 claims
- 0698US9142517B2Hybrid bonding mechanisms for semiconductor wafersTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Sep 22, 2015·247 cites·17 claims
- 0798US8809123B2Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafersLIU PING-YIN·Filed 2012·Granted Aug 19, 2014·238 cites·20 claims
- 0897US9960129B2Hybrid bonding mechanisms for semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 1, 2018·22 cites·17 claims
- 0997US9725310B2Micro electromechanical system sensor and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 8, 2017·14 cites·20 claims
- 1097US9425155B2Wafer bonding process and structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 23, 2016·28 cites·20 claims
- 1196US10790189B23D integrated circuit and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 29, 2020·9 cites·20 claims
- 1296US10665449B2Integrate rinse module in hybrid bonding platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 26, 2020·5 cites·20 claims
- 1396US9048283B2Hybrid bonding systems and methods for semiconductor wafersLIU PING-YIN·Filed 2012·Granted Jun 2, 2015·22 cites·20 claims
- 1496US8629524B2Apparatus for vertically integrated backside illuminated image sensorsWANG TZU-JUI·Filed 2012·Granted Jan 14, 2014·26 cites·12 claims
- 1595US9646860B2Alignment systems and wafer bonding systems and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 9, 2017·19 cites·20 claims
- 1695US9331032B2Hybrid bonding and apparatus for performing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 3, 2016·24 cites·20 claims
- 1795US9136302B2Apparatus for vertically integrated backside illuminated image sensorsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 15, 2015·11 cites·20 claims
- 1894US10354972B2Hybrid bonding systems and methods for semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 16, 2019·7 cites·20 claims
- 1994US9576827B2Apparatus and method for wafer level bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 21, 2017·15 cites·20 claims
- 2092US8647962B2Wafer level packaging bondLIU MARTIN·Filed 2010·Granted Feb 11, 2014·14 cites·13 claims
- 2191US9446467B2Integrate rinse module in hybrid bonding platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 20, 2016·9 cites·19 claims
- 2291US9412725B2Method and apparatus for image sensor packagingCHEN SZU-YING·Filed 2012·Granted Aug 9, 2016·12 cites·23 claims
- 2391US6875655B2Method of forming DRAM capacitors with protected outside crown surface for more robust structuresTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 5, 2005·63 cites·20 claims
- 2490US9748198B2Hybrid bonding systems and methods for semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 29, 2017·5 cites·20 claims
- 2590US8905293B2Self-removal anti-stiction coating for bonding processLIU PING-YIN·Filed 2010·Granted Dec 9, 2014·12 cites·19 claims
- 2690US8207595B2Semiconductor having a high aspect ratio viaHSIEH YUAN-CHIH·Filed 2010·Granted Jun 26, 2012·9 cites·14 claims
- 2789US9786628B2Air trench in packages incorporating hybrid bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 10, 2017·4 cites·20 claims
- 2889US9754827B1Semiconductor device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 5, 2017·4 cites·20 claims
- 2989US8846129B2Biological sensing structures and methods of forming the sameLIN HUNG-HUA·Filed 2012·Granted Sep 30, 2014·10 cites·20 claims
- 3088US9406711B2Apparatus and method for backside illuminated image sensorsCHEN SZU-YING·Filed 2012·Granted Aug 2, 2016·5 cites·20 claims
- 3187US9054121B2MEMS structures and methods for forming the sameLIU PING-YIN·Filed 2011·Granted Jun 9, 2015·5 cites·20 claims
- 3286US12255062B2Integrate rinse module in hybrid bonding platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 3386US10090196B23D integrated circuit and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 2, 2018·3 cites·20 claims
- 3486US10037968B2Alignment systems and wafer bonding systems and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 31, 2018·4 cites·20 claims
- 3585US8405169B2Handling layer for transparent substrateCHENG CHUN-REN·Filed 2010·Granted Mar 26, 2013·8 cites·20 claims
- 3684US8648468B2Hermetic wafer level packagingCHU RICHARD·Filed 2010·Granted Feb 11, 2014·7 cites·18 claims
- 3784US8598687B2Semiconductor having a high aspect ratio viaHSIEH YUAN-CHIH·Filed 2012·Granted Dec 3, 2013·5 cites·19 claims
- 3883US10276678B2Semiconductor device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·2 cites·20 claims
- 3983US10049901B2Apparatus and method for wafer level bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 14, 2018·3 cites·20 claims
- 4082US10096645B2Method and apparatus for image sensor packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 9, 2018·3 cites·20 claims
- 4181US8445380B2Semiconductor having a high aspect ratio viaHSIEH YUAN-CHIH·Filed 2012·Granted May 21, 2013·4 cites·20 claims
- 4279US2022310449A13D Integrated Circuit and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4378US11854795B2Integrate rinse module in hybrid bonding platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 4478US2022208607A13D Integrated Circuit and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4577US10128209B2Wafer bonding process and structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 13, 2018·2 cites·20 claims
- 4677US8790946B2Methods of bonding caps for MEMS devicesHUANG Xin-hua·Filed 2012·Granted Jul 29, 2014·5 cites·20 claims
- 4777US6640403B2Method for forming a dielectric-constant-enchanced capacitorVANGUARD INT SEMICONDUCT CORP·Filed 2001·Granted Nov 4, 2003·21 cites·20 claims
- 4876US11735635B2Semiconductor device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 4975US9887155B2Multiple metal layer semiconductor device and low temperature stacking method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Feb 6, 2018·3 cites·20 claims
- 5074US7851324B2Method of forming metal-insulator-metal structureTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Dec 14, 2010·4 cites·10 claims
Showing the top 50 of 88 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →