Assignee
LIU PING-YIN
TW·4 granted patents·277 citations·filing 2010–2012
Top patents by PatentIndex Score
4 records- 0198US8809123B2Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafersLIU PING-YIN·Filed 2012·Granted Aug 19, 2014·238 cites·20 claims
- 0296US9048283B2Hybrid bonding systems and methods for semiconductor wafersLIU PING-YIN·Filed 2012·Granted Jun 2, 2015·22 cites·20 claims
- 0390US8905293B2Self-removal anti-stiction coating for bonding processLIU PING-YIN·Filed 2010·Granted Dec 9, 2014·12 cites·19 claims
- 0487US9054121B2MEMS structures and methods for forming the sameLIU PING-YIN·Filed 2011·Granted Jun 9, 2015·5 cites·20 claims
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