Inventor · disambiguated record
Tibor Bolom
Also filed as: BOLOM TIBOR
11 granted patents·1 pending application·132 citations·filing 2005–2018
90Inventor score
Top patents by PatentIndex Score
12 records- 0195US7446036B1Gap free anchored conductor and dielectric structure and method for fabrication thereofIBM·Filed 2007·Granted Nov 4, 2008·42 cites·1 claims
- 0294US9177858B1Methods for fabricating integrated circuits including barrier layers for interconnect structuresGLOBALFOUNDRIES INC·Filed 2014·Granted Nov 3, 2015·32 cites·20 claims
- 0391US7329599B1Method for fabricating a semiconductor deviceADVANCED MICRO DEVICES INC·Filed 2005·Granted Feb 12, 2008·20 cites·18 claims
- 0487US10644099B1Three-dimensional (3D) metal-insulator-metal capacitor (MIMCAP) and methodGLOBALFOUNDRIES INC·Filed 2018·Granted May 5, 2020·5 cites·21 claims
- 0582US9111938B2Copper interconnect with CVD liner and metallic capIBM·Filed 2014·Granted Aug 18, 2015·5 cites·8 claims
- 0682US9059176B2Copper interconnect with CVD liner and metallic capBAUMANN FRIEDER HAINRICH·Filed 2012·Granted Jun 16, 2015·8 cites·18 claims
- 0780US8105942B2CMP-first damascene process schemeCHOI JIHONG·Filed 2010·Granted Jan 31, 2012·6 cites·14 claims
- 0879US7671362B2Test structure for determining optimal seed and liner layer thicknesses for dual damascene processingIBM·Filed 2007·Granted Mar 2, 2010·6 cites·7 claims
- 0977US9559059B2Methods of forming an improved via to contact interface by selective formation of a conductive capping layerGLOBALFOUNDRIES INC·Filed 2014·Granted Jan 31, 2017·4 cites·17 claims
- 1068US7985928B2Gap free anchored conductor and dielectric structure and method for fabrication thereofIBM·Filed 2008·Granted Jul 26, 2011·3 cites·1 claims
- 1162US9466530B2Methods of forming an improved via to contact interface by selective formation of a metal silicide capping layerGLOBALFOUNDRIES INC·Filed 2014·Granted Oct 11, 2016·1 cites·14 claims
- 1240US2014138837A1Sandwiched diffusion barrier and metal liner for an interconnect structureST MICROELECTRONICS INC·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →