Inventor · disambiguated record
Marc Zussy
Also filed as: ZUSSY MARC
20 granted patents·5 pending applications·400 citations·filing 1997–2019
94Inventor score
Files withCOMMISSARIAT ENERGIE ATOMIQUE13FOURNEL FRANK2ZUSSY MARC2COMMISARIAT L EN ATOMIQUE1COMMISSARIAT L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES1
Top patents by PatentIndex Score
25 records- 0194US5993677AProcess for transferring a thin film from an initial substrate onto a final substrateCOMMISSARIAT ENERGIE ATOMIQUE·Filed 1997·Granted Nov 30, 1999·194 cites·13 claims
- 0290US7811702B2Microbattery comprising through-connections and production method thereofCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2005·Granted Oct 12, 2010·12 cites·9 claims
- 0390US7713369B2Detachable substrate or detachable structure and method for the production thereofCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2002·Granted May 11, 2010·48 cites·18 claims
- 0484US8628674B2Method for trimming a structure obtained by the assembly of two platesSOITEC SILICON ON INSULATOR·Filed 2012·Granted Jan 14, 2014·6 cites·9 claims
- 0583US7494897B2Method of producing mixed substrates and structure thus obtainedCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2003·Granted Feb 24, 2009·29 cites·31 claims
- 0681US7541263B2Method for providing mixed stacked structures, with various insulating zones and/or electrically conducting zones vertically localizedCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2005·Granted Jun 2, 2009·8 cites·57 claims
- 0778US8329048B2Method for trimming a structure obtained by the assembly of two platesZUSSY MARC·Filed 2005·Granted Dec 11, 2012·9 cites·8 claims
- 0877US7205211B2Method for handling semiconductor layers in such a way as to thin sameCOMMISARIAT L EN ATOMIQUE·Filed 2003·Granted Apr 17, 2007·25 cites·27 claims
- 0976US6197695B1Process for the manufacture of passive and active components on the same insulating substrateCOMMISSARIAT ENERGIE ATOMIQUE·Filed 1999·Granted Mar 6, 2001·51 cites·32 claims
- 1072US11088010B2Temporary bonding method with thermoplastic adhesive incorporating a rigid ringCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2019·Granted Aug 10, 2021·1 cites·9 claims
- 1168US8828244B2Method for building a substrate holderFOURNEL FRANK·Filed 2011·Granted Sep 9, 2014·3 cites·18 claims
- 1267US9219004B2Method of fabricating polymer film in the cavity of a waferMORICEAU HUBERT·Filed 2011·Granted Dec 22, 2015·2 cites·16 claims
- 1365US8302278B2Method and device for separating a structureZUSSY MARC·Filed 2008·Granted Nov 6, 2012·2 cites·31 claims
- 1464US7947564B2Method of fabricating a mixed microtechnology structure and a structure obtained therebyCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2007·Granted May 24, 2011·3 cites·28 claims
- 1558US9321636B2Method for producing a substrate holderFOURNEL FRANK·Filed 2012·Granted Apr 26, 2016·1 cites·25 claims
- 1653US7229897B2Method for producing a stacked structureCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2001·Granted Jun 12, 2007·6 cites·29 claims
- 1748US9330957B2Process for assembling two wafers and corresponding deviceHALIMAOUI AOMAR·Filed 2011·Granted May 3, 2016·0 cites·15 claims
- 1846US10818500B2Method for wafer trimmingCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2018·Granted Oct 27, 2020·0 cites·13 claims
- 1946US10100400B2Method for recycling a substrate holderCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2013·Granted Oct 16, 2018·0 cites·14 claims
- 2046US2016218178A1Process for assembling two wafers and corresponding deviceST MICROELECTRONICS CROLLES 2 SAS·Filed 2016·Application pending·0 cites
- 2145US2014238213A1Method for performing a mechanical operation in a structure comprising two layers of different stiffnessCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2012·Application pending·0 cites
- 2239US9842742B2Method for thinning samplesCOMMISSARIAT ÀL'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES·Filed 2016·Granted Dec 12, 2017·0 cites·15 claims
- 2339US2008311725A1Method For Assembling Substrates By Depositing An Oxide Or Nitride Thin Bonding LayerDI CIOCCIO LEA·Filed 2006·Application pending·0 cites
- 2438US2008020547A1Method Of Transferring At Least One Object Of Micrometric Or Millimetric Size By Means Of A Polymer HandleKOSTRZEWA MAREK·Filed 2005·Application pending·0 cites
- 2537US2006128134A1Method for re-routing lithography-free microelectronic devicesCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →