Inventor · disambiguated record
Edward Then
Also filed as: THEN EDWARD
3 granted patents·1 pending application·10 citations·filing 2003–2018
59Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0153US7262077B2Capillary underfill and mold encapsulation method and apparatusINTEL CORP·Filed 2003·Granted Aug 28, 2007·9 cites·27 claims
- 0252US9196504B2Thermal leadless array package with die attach pad locking featureLOH ALBERT·Filed 2012·Granted Nov 24, 2015·1 cites·11 claims
- 0340US2008017976A1Capillary underfill and mold encapsulation method and apparatusINTEL CORP·Filed 2007·Application pending·0 cites
- 0434US11817360B2Chip scale package semiconductor device and method of manufactureNexperia BV·Filed 2018·Granted Nov 14, 2023·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →