Inventor · disambiguated record
Fumihiko Ooka
Also filed as: OOKA FUMIHIKO
9 granted patents·2 pending applications·100 citations·filing 1999–2010
87Inventor score
Technology areasH10W
Top patents by PatentIndex Score
11 records- 0190US7571647B2Package structure for an acceleration sensorOKI SEMICONDUCTOR CO LTD·Filed 2005·Granted Aug 11, 2009·26 cites·21 claims
- 0288US7884466B2Semiconductor device with double-sided electrode structure and its manufacturing methodOKI ELECTRIC IND CO LTD·Filed 2007·Granted Feb 8, 2011·15 cites·10 claims
- 0376US7410829B2Method of fabricating a semiconductor chip packageOKI ELECTRIC IND CO LTD·Filed 2007·Granted Aug 12, 2008·7 cites·6 claims
- 0476US6300685B1Semiconductor packageOKI ELECTRIC IND CO LTD·Filed 1999·Granted Oct 9, 2001·40 cites·10 claims
- 0564US7304395B2Semiconductor chip packageOKI ELECTRIC IND CO LTD·Filed 2006·Granted Dec 4, 2007·3 cites·11 claims
- 0659US6677219B2Method of forming a ball grid array packageOKI ELECTRIC IND CO LTD·Filed 2001·Granted Jan 13, 2004·7 cites·18 claims
- 0747US6975039B2Method of forming a ball grid array packageOKI ELECTRIC IND CO LTD·Filed 2003·Granted Dec 13, 2005·2 cites·16 claims
- 0845US2011089551A1Semiconductor device with double-sided electrode structure and its manufacturing methodOKI ELECTRIC IND CO LTD·Filed 2010·Application pending·0 cites
- 0942US7489043B2Semiconductor chip package and fabrication method thereofOKI ELECTRIC IND CO LTD·Filed 2006·Granted Feb 10, 2009·0 cites·5 claims
- 1040US2006157835A1Semiconductor device and method of fabricating sameOOKA FUMIHIKO·Filed 2006·Application pending·0 cites
- 1133US7569917B2Semiconductor deviceOKI SEMICONDUCTOR CO LTD·Filed 2007·Granted Aug 4, 2009·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →