Inventor · disambiguated record
Hsien-Lung Ho
Also filed as: HO HSIEN-LUNG
10 granted patents·13 pending applications·24 citations·filing 2004–2022
83Inventor score
Files withWALSIN LIHWA CORP6TOUCH MICRO SYSTEM TECH4UPBEAT TECH CO LTD4HO HSIEN-LUNG3CHIANG CHUNG-I2
Top patents by PatentIndex Score
23 records- 0185US11905164B2Micro-electro-mechanical system acoustic sensor, micro-electro-mechanical system package structure and method for manufacturing the sameUPBEAT TECH CO LTD·Filed 2021·Granted Feb 20, 2024·1 cites·20 claims
- 0275US7258806B1Method of fabricating a diaphragm of a capacitive microphone deviceTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Aug 21, 2007·8 cites·9 claims
- 0374US8217329B2Microminiaturized projection module having an image processing unit for transforming each of image signals into a modulating signal and a direction signal for projecting image onto objectCHIANG CHUNG-I·Filed 2010·Granted Jul 10, 2012·3 cites·21 claims
- 0473US8455910B2Method of manufacturing light emitting diode packaging lens and light emitting diode packageCHIANG CHUNG-I·Filed 2009·Granted Jun 4, 2013·6 cites·7 claims
- 0568US7585417B2Method of fabricating a diaphragm of a capacitive microphone deviceTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Sep 8, 2009·5 cites·9 claims
- 0663US10261309B2Liquid lens chip, driving apparatus and driving method thereofUNIV NAT TSING HUA·Filed 2017·Granted Apr 16, 2019·1 cites·12 claims
- 0754US12172886B2Micro-electro-mechanical system (MEMS) vibration sensor and fabricating method thereofUPBEAT TECH CO LTD·Filed 2022·Granted Dec 24, 2024·0 cites·14 claims
- 0850US11665485B2Micro-electro-mechanical system acoustic sensor, micro-electro-mechanical system package structure and method for manufacturing the sameUPBEAT TECH CO LTD·Filed 2021·Granted May 30, 2023·0 cites·17 claims
- 0949US2011080108A1Color tunable light emitting diodeWALSIN LIHWA CORP·Filed 2009·Application pending·0 cites
- 1048US7938977B2Method of modulating resonant frequency of torsional MEMS deviceTOUCH MICRO SYSTEM TECH·Filed 2010·Granted May 10, 2011·0 cites·10 claims
- 1147US2013233710A1Method of manufacturing light emitting diode packaging lens and light emmiting diode packageWALSIN LIHWA CORP·Filed 2013·Application pending·0 cites
- 1244US7674392B2Method of fabricating a hingeTOUCH MICRO SYSTEM TECH·Filed 2006·Granted Mar 9, 2010·0 cites·14 claims
- 1343US2010002285A1Torsional mems deviceHUANG LONG-SUN·Filed 2008·Application pending·0 cites
- 1442US2024208801A1Micro-electro-mechanical system (mems) vibration sensor and fabricating method thereofUPBEAT TECH CO LTD·Filed 2022·Application pending·0 cites
- 1540US2011221663A1Edge type backlighting moduleWALSIN LIHWA CORP·Filed 2010·Application pending·0 cites
- 1639US2011163679A1Ac light emitting diode device having integrated passive deviceWALSIN LIHWA CORP·Filed 2010·Application pending·0 cites
- 1738US2010002284A1Method of modulating resonant frequency of torsional mems deviceHUANG LONG-SUN·Filed 2008·Application pending·0 cites
- 1837US2013002610A1Touch sensitive display deviceHON HAI PREC IND CO LTD·Filed 2012·Application pending·0 cites
- 1937US2013105668A1Reflective display device with light compensation moduleHO HSIEN-LUNG·Filed 2011·Application pending·0 cites
- 2036US2011198619A1Light emitting diode assembly having improved lighting efficiencyWALSIN LIHWA CORP·Filed 2010·Application pending·0 cites
- 2135US2012242623A1Touch sensitive device and display device employing the sameHO HSIEN-LUNG·Filed 2011·Application pending·0 cites
- 2235US2005215029A1Method for fixing wafer used in manufacturing procedureWALSIN LIHWA CORP·Filed 2004·Application pending·0 cites
- 2334US2012230055A1Front light illumination device and reflective display device employing the sameHO HSIEN-LUNG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →