Inventor · disambiguated record
Ken Orui
Also filed as: ORUI KEN
5 granted patents·1 pending application·29 citations·filing 2003–2009
78Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0183US7421777B2Method of manufacturing multilayer wiring substrate using temporary metal support layerSONY CORP·Filed 2005·Granted Sep 9, 2008·12 cites·6 claims
- 0278US7420127B2Method of manufacturing multilayer wiring substrate, and multilayer wiring substrateSONY CORP·Filed 2006·Granted Sep 2, 2008·6 cites·14 claims
- 0363US8146243B2Method of manufacturing a device incorporated substrate and method of manufacturing a printed circuit boardASAMI HIROSHI·Filed 2009·Granted Apr 3, 2012·3 cites·13 claims
- 0454US7053315B2Junction structure and junction method for conductive projectionSONY CORP·Filed 2004·Granted May 30, 2006·8 cites·6 claims
- 0551US2007293038A1Method of manufacturing multilayer wiring substrate, and multilayer wiring substrateSONY CORP·Filed 2007·Application pending·0 cites
- 0640US7288724B2Method of manufacturing multilayer wiring substrate, and multilayer wiring substrateSONY CORP·Filed 2003·Granted Oct 30, 2007·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →