Inventor · disambiguated record
Chenzhou Lian
Also filed as: LIAN CHENZHOU
6 granted patents·4 pending applications·35 citations·filing 2012–2020
79Inventor score
Top patents by PatentIndex Score
10 records- 0194US9401315B1Thermal hot spot cooling for semiconductor devicesGLOBALFOUNDRIES INC·Filed 2015·Granted Jul 26, 2016·16 cites·20 claims
- 0290US9437515B2Heat spreading layer with high thermal conductivityIBM·Filed 2015·Granted Sep 6, 2016·6 cites·1 claims
- 0386US8444043B1Uniform solder reflow fixtureBERNIER WILLIAM E·Filed 2012·Granted May 21, 2013·11 cites·18 claims
- 0474US9226426B2Electronic device console with natural draft coolingBODENWEBER PAUL F·Filed 2012·Granted Dec 29, 2015·2 cites·18 claims
- 0570US11825592B2Electronic device console with natural draft coolingIBM·Filed 2020·Granted Nov 21, 2023·0 cites·19 claims
- 0655US10834808B2Electronic device console with natural draft coolingIBM·Filed 2015·Granted Nov 10, 2020·0 cites·18 claims
- 0754US2014284040A1Heat spreading layer with high thermal conductivityIBM·Filed 2013·Application pending·0 cites
- 0852US2015371917A1Heat spreading layer with high thermal conductivityIBM·Filed 2015·Application pending·0 cites
- 0952US2015373879A1Heat spreading layer with high thermal conductivityIBM·Filed 2015·Application pending·0 cites
- 1052US2015371918A1Heat spreading layer with high thermal conductivityIBM·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chenzhou Lian files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →