Inventor · disambiguated record
Taryn J. Davis
Also filed as: DAVIS TARYN J
11 granted patents·4 pending applications·49 citations·filing 2013–2018
88Inventor score
Top patents by PatentIndex Score
15 records- 0194US9401315B1Thermal hot spot cooling for semiconductor devicesGLOBALFOUNDRIES INC·Filed 2015·Granted Jul 26, 2016·16 cites·20 claims
- 0293US10032683B2Time temperature monitoring systemIBM·Filed 2015·Granted Jul 24, 2018·10 cites·5 claims
- 0390US10504807B2Time temperature monitoring systemIBM·Filed 2018·Granted Dec 10, 2019·5 cites·19 claims
- 0490US10008427B2Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoringIBM·Filed 2017·Granted Jun 26, 2018·3 cites·20 claims
- 0590US9437515B2Heat spreading layer with high thermal conductivityIBM·Filed 2015·Granted Sep 6, 2016·6 cites·1 claims
- 0686US10553503B2Method and structure for flip-chip package reliability monitoring using capacitive sensors groupsIBM·Filed 2017·Granted Feb 4, 2020·2 cites·9 claims
- 0785US10134649B2Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoringIBM·Filed 2016·Granted Nov 20, 2018·2 cites·19 claims
- 0884US9818655B2Method and structure for flip-chip package reliability monitoring using capacitive sensors groupsIBM·Filed 2015·Granted Nov 14, 2017·2 cites·11 claims
- 0976US9911716B2Polygon die packagingIBM·Filed 2015·Granted Mar 6, 2018·3 cites·2 claims
- 1062US10068812B2Method and structure for flip-chip package reliability monitoring using capacitive sensors groupsIBM·Filed 2017·Granted Sep 4, 2018·0 cites·1 claims
- 1160US10217682B2Time temperature monitoring systemIBM·Filed 2018·Granted Feb 26, 2019·0 cites·19 claims
- 1254US2014284040A1Heat spreading layer with high thermal conductivityIBM·Filed 2013·Application pending·0 cites
- 1352US2015371917A1Heat spreading layer with high thermal conductivityIBM·Filed 2015·Application pending·0 cites
- 1452US2015373879A1Heat spreading layer with high thermal conductivityIBM·Filed 2015·Application pending·0 cites
- 1552US2015371918A1Heat spreading layer with high thermal conductivityIBM·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →