Inventor · disambiguated record
Insang Yoon
Also filed as: YOON INSANG
12 granted patents·31 citations·filing 2012–2022
87Inventor score
Top patents by PatentIndex Score
12 records- 0195US10388637B2Semiconductor device and method of forming a 3D interposer system-in-package moduleSTATS CHIPPAC PTE LTD·Filed 2017·Granted Aug 20, 2019·8 cites·24 claims
- 0292US10804217B2EMI shielding for flip chip package with exposed die backsideSTATS CHIPPAC PTE LTD·Filed 2019·Granted Oct 13, 2020·6 cites·22 claims
- 0391US10797039B2Semiconductor device and method of forming a 3D interposer system-in-package moduleSTATS CHIPPAC PTE LTD·Filed 2018·Granted Oct 6, 2020·6 cites·21 claims
- 0490US11342278B2EMI shielding for flip chip package with exposed die backsideSTATS CHIPPAC PTE LTD·Filed 2020·Granted May 24, 2022·2 cites·23 claims
- 0586US10418341B2Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulantSTATS CHIPPAC PTE LTD·Filed 2017·Granted Sep 17, 2019·4 cites·25 claims
- 0676US11715703B2EMI shielding for flip chip package with exposed die backsideSTATS CHIPPAC PTE LTD·Filed 2022·Granted Aug 1, 2023·0 cites·23 claims
- 0773US10629565B2Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulantSTATS CHIPPAC PTE LTD·Filed 2019·Granted Apr 21, 2020·1 cites·22 claims
- 0872US9331007B2Semiconductor device and method of forming conductive ink layer as interconnect structure between semiconductor packagesSTATS CHIPPAC LTD·Filed 2012·Granted May 3, 2016·3 cites·19 claims
- 0967US10804119B2Method of forming SIP module over film layerSTATS CHIPPAC PTE LTD·Filed 2017·Granted Oct 13, 2020·1 cites·18 claims
- 1065US11842991B2Semiconductor device and method of forming a 3D interposer system-in-package moduleSTATS CHIPPAC PTE LTD·Filed 2020·Granted Dec 12, 2023·0 cites·21 claims
- 1164US11309193B2Semiconductor device and method of forming SIP module over film layerSTATS CHIPPAC PTE LTD·Filed 2020·Granted Apr 19, 2022·0 cites·18 claims
- 1243US10319684B2Dummy conductive structures for EMI shieldingSTATS CHIPPAC PTE LTD·Filed 2017·Granted Jun 11, 2019·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →