Inventor · disambiguated record
Ssang-Gun Lim
Also filed as: LIM SSANG-GUN
9 granted patents·3 pending applications·48 citations·filing 2001–2012
84Inventor score
Top patents by PatentIndex Score
12 records- 0171US7092105B2Method and apparatus for measuring the three-dimensional surface shape of an object using color informations of light reflected by the objectINTEK PLUS CO LTD·Filed 2001·Granted Aug 15, 2006·21 cites·20 claims
- 0266US6873421B2Method and apparatus for measuring the three-dimensional shape of an object using a moire equipmentINTEK PLUS CO LTD·Filed 2001·Granted Mar 29, 2005·18 cites·9 claims
- 0358US8319961B2Apparatus to perform a non-contact test of a semiconductor packageRYU CHANG-HYUN·Filed 2009·Granted Nov 27, 2012·3 cites·29 claims
- 0454US8890533B2Apparatus for inspecting light emitting diode package and inspecting method using the sameLIM SSANG GUN·Filed 2010·Granted Nov 18, 2014·2 cites·28 claims
- 0549US8155483B2Apparatus for and method of measuring imageLEE SANG-YOON·Filed 2006·Granted Apr 10, 2012·1 cites·4 claims
- 0648US8259305B2Surface shape measuring system and surface shape measuring method using the sameLEE SANG-YUN·Filed 2008·Granted Sep 4, 2012·1 cites·10 claims
- 0745US2008266391A1Apparatus for and Method of Measuring ImageLEE SANG-YOON·Filed 2006·Application pending·0 cites
- 0841US2014104411A1Apparatus to perform a non-contact test of a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 0940US8493570B2Three-dimensional shape measuring apparatusYOU JOON-HO·Filed 2008·Granted Jul 23, 2013·2 cites·9 claims
- 1039US2010171963A1Apparatus for measurement of three-dimensional shapeINTEKPLUS CO LTD·Filed 2008·Application pending·0 cites
- 1136US9218050B2Method and device for transmitting/receiving image data at high speedKANG MIN-GU·Filed 2011·Granted Dec 22, 2015·0 cites·11 claims
- 1234US9412159B2Method for inspecting flat panelSON JAI-HO·Filed 2012·Granted Aug 9, 2016·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →