Apparatus to perform a non-contact test of a semiconductor package

Abstract

An apparatus to test a semiconductor package includes a vertical illuminator to supply vertical illumination in the same axial direction as a measurement target and a vertical image unit to capture a vertical image of the measurement target so that a testing apparatus may 2-dimensionally determine information on the shape, size, or position of a solder ball. An inclined illuminator may supply inclined illumination in a different axial direction from the measurement target, and an inclined image capture unit may capture a side image of the measurement target so that the testing apparatus may 3-dimensionally determine information on a state of contact of the solder ball with the ball land. The inclined image capture unit may include a color camera using color information, thereby markedly increasing test reliability and yield.

What is claimed is: 
     
         1 . A method of testing a tested device, the method comprising:
 positioning the tested device to have a length axis parallel to a first direction;   emitting a first light to travel in the first direction to contact a test area of the tested device;   capturing a first image of the test area generated by the first light reflected off of the test area of the tested device at a 180° angle with respect to the first direction;   emitting a second light to travel in a second direction that is not parallel to the first direction; and   capturing a second image of the test area generated by the second light reflected off of the test area at a second angle that is not parallel to the first direction,   wherein capturing the second image comprises capturing the second image including an information which is different from an information included in the first image.   
     
     
         2 . The method according to  claim 1 , further comprising:
 capturing color data of the second image.   
     
     
         3 . The method according to  claim 2 , wherein the color data corresponds to red, green, and blue color of the test area. 
     
     
         4 . The method according to  claim 2 , wherein capturing the second image includes capturing light that travels parallel to the first direction. 
     
     
         5 . The method according to  claim 4 , wherein an image-capture device is mounted to receive light at an angle that is not parallel to the first direction, and
 a light path of the light that travels parallel to the first direction is adjusted to enter an image-receiving surface of the image-capture device at an angle parallel to a center length axis of the image-capture device.   
     
     
         6 . The method according to  claim 1 , wherein emitting the first light comprises:
 emitting the first light in a second direction perpendicular to the first direction; and   reflecting the first light off of a beam-splitting mirror to travel parallel to the first direction toward the target area, and   wherein capturing the first image comprises capturing light reflected off of the target area and passed through the beam-splitting mirror.   
     
     
         7 . The method according to  claim 1 , wherein capturing the second image comprises:
 capturing the second light reflected off of the test area at an angle that is not parallel to the first direction and reflected off of a mirror to travel in a direction parallel to the first direction.   
     
     
         8 . The method according to  claim 1 , further comprising:
 providing a first illumination device to emit the first light, a second illumination device to emit the second light, a first image-capture device to capture the first image, and a second image capture device to capture the second image;   mounting the first illumination device, the second illumination device, the first image-capture device, and the second image capture device to a case having a hole in a bottom of the case to pass light; and   positioning the tested device outside the case adjacent to the hole.