Inventor · disambiguated record
Takeshi Kitahara
Also filed as: KITAHARA TAKESHI
59 granted patents·13 pending applications·731 citations·filing 1975–2023
98Inventor score
Top patents by PatentIndex Score
72 records- 0194US5068141APolyolefin-type nonwoven fabric and method of producing the sameUNITIKA LTD·Filed 1989·Granted Nov 26, 1991·111 cites·5 claims
- 0294US4981749APolyolefin-type nonwoven fabric and method of producing the sameUNITIKA LTD·Filed 1989·Granted Jan 1, 1991·63 cites·4 claims
- 0393US6813750B2Logic circuit design equipment and method for designing logic circuit for reducing leakage currentTOSHIBA KK·Filed 2002·Granted Nov 2, 2004·105 cites·20 claims
- 0488US5266849ATri state buffer circuit for dual power systemHAL COMPUTER SYSTEMS INC·Filed 1992·Granted Nov 30, 1993·53 cites·11 claims
- 0583US11330497B2Communication control apparatus, control method thereof, and storage mediumKDDI CORP·Filed 2020·Granted May 10, 2022·2 cites·22 claims
- 0682US10211068B2Power-module substrate with cooler and method of producing the sameMITSUBISHI MATERIALS CORP·Filed 2015·Granted Feb 19, 2019·4 cites·5 claims
- 0780US8198540B2Power element mounting substrate, method of manufacturing the same, power element mounting unit, method of manufacturing the same, and power moduleKUROMITSU YOSHIROU·Filed 2007·Granted Jun 12, 2012·10 cites·15 claims
- 0877US8564118B2Power module substrate, power module, and method for manufacturing power module substrateKUROMITSU YOSHIROU·Filed 2009·Granted Oct 22, 2013·5 cites·9 claims
- 0977US7432306B2Method for preparing novel transcription factors and useNRL PHARMA INC·Filed 2005·Granted Oct 7, 2008·3 cites·16 claims
- 1076US6318911B1Gated clock design supporting method, gated clock design supporting apparatus, and computer readable memory storing gated clock design supporting programTOSHIBA KK·Filed 1998·Granted Nov 20, 2001·73 cites·20 claims
- 1176US3983134AUreylenethiophanes and their related compounds, and production thereofTEIKOKU CHEM IND CO LTD·Filed 1975·Granted Sep 28, 1976·10 cites·7 claims
- 1275US11043128B1Merging support information distribution apparatus, merging support system, merging support information distribution method, and computer programTOYOTA MOTOR CO LTD·Filed 2020·Granted Jun 22, 2021·1 cites·4 claims
- 1375US8609993B2Power module substrate, power module, and method for manufacturing power module substrateKUROMITSU YOSHIROU·Filed 2009·Granted Dec 17, 2013·5 cites·3 claims
- 1474US7889688B2Radio communication apparatus and traffic control method for extending drive-time of batteryKDDI CORP·Filed 2007·Granted Feb 15, 2011·6 cites·9 claims
- 1574US6457167B1Gated clock design supporting method, gated clock design supporting apparatus, and computer readable memory storing gated clock design supporting programTOSHIBA KK·Filed 2000·Granted Sep 24, 2002·19 cites·9 claims
- 1673US8921996B2Power module substrate, power module, and method for manufacturing power module substrateMITSUBISHI MATERIALS CORP·Filed 2013·Granted Dec 30, 2014·2 cites·20 claims
- 1769US11908768B2Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate boardMITSUBISHI MATERIALS CORP·Filed 2022·Granted Feb 20, 2024·0 cites·1 claims
- 1869US9079264B2Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrateMITSUBISHI MATERIALS CORP·Filed 2013·Granted Jul 14, 2015·2 cites·10 claims
- 1968US6272667B1Method and apparatus for clock gated logic circuits to reduce electric power consumptionTOSHIBA KK·Filed 1998·Granted Aug 7, 2001·48 cites·10 claims
- 2068US4710915ALoop transmission system having automatic loop configuration control meansFUJITSU LTD·Filed 1985·Granted Dec 1, 1987·34 cites·10 claims
- 2166US8044500B2Power module substrate, method for manufacturing power module substrate, and power moduleMITSUBISHI MATERIALS CORP·Filed 2007·Granted Oct 25, 2011·3 cites·4 claims
- 2266US7962883B2Developing semiconductor circuit design with conditional flipflops to save power consumptionTOSHIBA KK·Filed 2008·Granted Jun 14, 2011·3 cites·10 claims
- 2366US7543258B2Clock design apparatus and clock design methodTOSHIBA KK·Filed 2006·Granted Jun 2, 2009·5 cites·19 claims
- 2466US4516173AImage data conversion method and character code/character pattern conversion apparatusFUJITSU LTD·Filed 1982·Granted May 7, 1985·18 cites·23 claims
- 2565US6915497B2Automatic design system for wiring on LSITOSHIBA KK·Filed 2003·Granted Jul 5, 2005·11 cites·2 claims
- 2665US6557143B1Computer aided design system and computer-readable medium storing a program for designing clock gated logic circuits and gated clock circuitTOSHIBA KK·Filed 2000·Granted Apr 29, 2003·9 cites·3 claims
- 2763US8116084B2Method for manufacturing power module substrate, power module substrate, and power moduleKITAHARA TAKESHI·Filed 2008·Granted Feb 14, 2012·3 cites·4 claims
- 2863US2022223493A1Insulation circuit board with heat sinkMITSUBISHI MATERIALS CORP·Filed 2022·Application pending·0 cites
- 2962US6668363B2Clock supplying circuit and method having enable buffer cells with first and second input terminalsTOSHIBA KK·Filed 2001·Granted Dec 23, 2003·8 cites·12 claims
- 3059US8311052B2Control of packet buffer using token buckets with different token bucket sizesNAKAMURA HAJIME·Filed 2010·Granted Nov 13, 2012·2 cites·9 claims
- 3157US5282146ATest assistant system for logical design processTOSHIBA KK·Filed 1991·Granted Jan 25, 1994·33 cites·5 claims
- 3256US9101063B2Power module substrate, power module, and method for manufacturing power module substrateMITSUBISHI MATERIALS CORP·Filed 2013·Granted Aug 4, 2015·0 cites·3 claims
- 3356US9095062B2Power module substrate, power module, and method for manufacturing power module substrateMITSUBISHI MATERIALS CORP·Filed 2013·Granted Jul 28, 2015·0 cites·2 claims
- 3456US8637777B2Power module substrate having heatsink, method for manufacturing the same, power module having heatsink, and power module substrateHAYASHI HIROMASA·Filed 2009·Granted Jan 28, 2014·1 cites·12 claims
- 3556US7216329B2Automatic circuit design apparatus, method for automatically designing a circuit, and computer program product for executing an application for an automatic circuit design apparatusTOSHIBA KK·Filed 2004·Granted May 8, 2007·5 cites·20 claims
- 3656US2025391743A1Multilayer assembly, semiconductor device using same, and method for manufacturing sameMITSUBISHI MATERIALS CORP·Filed 2023·Application pending·0 cites
- 3755US12356554B2Method for manufacturing bonded body and method for manufacturing insulation circuit substrateMITSUBISHI MATERIALS CORP·Filed 2021·Granted Jul 8, 2025·0 cites·4 claims
- 3855US11289400B2Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate boardMITSUBISHI MATERIALS CORP·Filed 2019·Granted Mar 29, 2022·0 cites·26 claims
- 3955US2015022977A1Power module substrate, power module, and method for manufacturing power module substrateMITSUBISHI MATERIALS CORP·Filed 2014·Application pending·0 cites
- 4055US2014110771A1Solid-state imaging device and semiconductor deviceTOSHIBA KK·Filed 2013·Application pending·0 cites
- 4154US11322424B2Insulation circuit board with heat sinkMITSUBISHI MATERIALS CORP·Filed 2019·Granted May 3, 2022·0 cites·5 claims
- 4253US5378961ADeflection yoke apparatusTOSHIBA KK·Filed 1994·Granted Jan 3, 1995·13 cites·5 claims
- 4352US7062725B2Computer aided design system and computer-readable medium storing a program for designing clock gated logic circuits and gated clock circuitTOSHIBA KK·Filed 2003·Granted Jun 13, 2006·2 cites·10 claims
- 4451US2008028343A1Semiconductor integrated circuit and method of designing the sameTOSHIBA KK·Filed 2007·Application pending·0 cites
- 4551US2010258233A1Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrateMITSUBISHI MATERIALS CORP·Filed 2008·Application pending·0 cites
- 4649US11676882B2Method of manufacturing power module substrate board and ceramic-copper bonded bodyMITSUBISHI MATERIALS CORP·Filed 2019·Granted Jun 13, 2023·0 cites·3 claims
- 4748US2011010684A1Semiconductor integrated circuit and method of designing the sameTOSHIBA KK·Filed 2010·Application pending·0 cites
- 4847US11289390B2Insulation circuit board with heat sinkMITSUBISHI MATERIALS CORP·Filed 2019·Granted Mar 29, 2022·0 cites·10 claims
- 4945US7629471B2Transcriptional factor, process for producing the same and use thereofNRL PHARMA INC·Filed 2004·Granted Dec 8, 2009·0 cites·16 claims
- 5044US11355408B2Method of manufacturing insulating circuit board with heatsinkMITSUBISHI MATERIALS CORP·Filed 2019·Granted Jun 7, 2022·0 cites·8 claims
Showing the top 50 of 72 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →